Impact of interfacial engineering on MgO-based resistive switching devices for low-power applications

Samuel Chen Wai Chow,Putu Andhita Dananjaya,Jia Min Ang,Desmond Jia Jun Loy,Jia Rui Thong,Siew Wei Hoo,Eng Huat Toh,Wen Siang Lew
DOI: https://doi.org/10.1016/j.apsusc.2022.155233
IF: 6.7
2022-10-16
Applied Surface Science
Abstract:In this work, the resistive switching characteristics of MgO/Al 2 O 3 -based resistive random-access memory (ReRAM) devices have been reported. Analysis shows the change in dominant conduction mechanism from space-charge-limited conduction to Schottky emission owing to the incorporation of an Al 2 O 3 insertion layer. The MgO/Al 2 O 3 bilayer ReRAM devices exhibit lower power operation (50.6% reduction) and better switching uniformity as compared to single-layer devices, depending on the stack configuration. This can be attributed to the lower oxygen vacancy accumulation and filament confinement at the MgO/Al 2 O 3 interface, resulting in a more controllable switching operation. Further X-ray photoelectron spectroscopy (XPS) depth profile analysis of the bilayer device reveals that the switching dynamics are correlated directly with the oxygen vacancy concentrations. These findings indicate the importance of interfacial layer engineering in improving the resistive switching properties of MgO-based memory devices, thus allowing for low-power applications.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
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