Intrinsic toughened conductive thermosetting epoxy resins: utilizing dynamic bond and electrical conductivity to access electric and thermal dual-driven shape memory

Shiwei Zhao,Qinfeng Liu,Anqian Yuan,Zhimeng Liu,Shiyi Zhou,Xiaowei Fu,Jingxin Lei,Liang Jiang
DOI: https://doi.org/10.1039/d2qm00509c
IF: 8.6834
2022-06-08
Materials Chemistry Frontiers
Abstract:Epoxy resin is currently the most widely used thermosetting polymers for their high thermal stability, excellent electrical insulation and chemical resistance. However, the application of epoxy resin was greatly limited by the inherent defects of poor toughness, difficult recyclability and lacking shape plasticity due to forming three-dimensional network structure. In this work, a uniquely intrinsic toughened thermosetting epoxy resin, namely EPUs, was synthesized via integrating the conductive black (CB) and polyurethane system into the traditional thermosetting epoxy resins. This work cleverly introduces polyurethane system into the molecular chain of epoxy resin, not only improving their intrinsic toughness from the molecular structure level, but also endowing these epoxy resin with dynamic performance because of the reversible exchange reaction between carbamate bonds at high temperature. The devised EPUs has tunable and remarkable mechanical properties by different ratios of polyurethane system, whose maximum value of ultimate tensile strength and elongation at break can reach 20.7 MPa and 430.1%. Especially, with the help of the dynamic performance, the synthetic conductive thermosetting epoxy resin (EPU1-CBs) can realize the thermotropic shape memory function, displaying the intriguingly thermal and electric-induced shape plasticity. In this dual-driven process, the voltage can be applied at any two places of the EPU1-CBs to achieve precise local heating, achieving the faster electric-induced shape memory. It is of great significance to design this style EPUs and EPU1-CBs for solving the poor toughness of traditional thermosetting epoxy resins and their difficult shape plasticity after curing to cross-linked network. Importantly, it provides a new route for devising intrinsic toughened conductive thermosetting epoxy resins through molecular structure, greatly expanding the application field of epoxy resin.
materials science, multidisciplinary,chemistry
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