Gastrin and somatostatin in the rat antrum. The effect of removal of acid-secreting mucosa

L. Lundell,A. Bishop,S. Bloom,K. Carlsson,H. Mattsson,J. Polak,B. Ryberg

DOI: https://doi.org/10.1016/0167-0115(88)90423-5

1988-10-01

Regulatory Peptides

Abstract:

What problem does this paper attempt to address?

Highly Thermal Conductive Benzoxazine‐epoxy Interpenetrating Polymer Networks Containing Liquid Crystalline Structures

Ying Liu,Jiming Chen,Yaoheng Zhang,Sheng Gao,Zaijun Lu,Qingbin Xue

DOI: https://doi.org/10.1002/polb.24414

IF: 3.046

2017-01-01

Journal of Polymer Science

Abstract:ABSTRACT A diamine‐based benzoxazine monomer (Bz) and a liquid crystalline epoxy monomer (LCE) are synthesized, respectively. Subsequently, a benzoxazine‐epoxy interpenetrating polymer network (PBEI) containing liquid crystalline structures is obtained by sequential curing of the LCE and the Bz in the presence of imidazole. The results show that the preferential curing of LCE plays a key role in the formation mechanism of liquid crystalline phase. Due to the introduction of liquid crystalline structures, the thermal conductivity of PBEI increases with increasing content of LCE. When the content of LCE is 80 wt %, the thermal conductivity reaches 0.32 W m −1 K −1 . Additionally, the heat‐resistance of PBEI is superior to liquid crystalline epoxy resin. Among them, PBEI55 containing equal weight of Bz and LCE has better comprehensive performance. Its thermal conductivity, glass transition temperature, and the 5 % weight loss temperature are 0.28 W m −1 K −1 , 160 °C, and 339 °C, respectively. By introducing boron nitride (BN) fillers into PBEI55, a composite of PBEI/BN with the highest thermal conductivity of 3.00 W m −1 K −1 is obtained. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55 , 1813–1821
Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

M. Awais,C. Dai,F. B. Meng,A. Paramane,X. Wang,X. Chen

DOI: https://doi.org/10.1049/icp.2022.0035

2021-01-01

Abstract:Epoxy resin insulations are considered as a potential candidate for various applications like transformers, cable terminations, power electronic device packaging, and bushings. This has promoted a great interest in their use as high voltage insulation materials for high frequency applications. This work presents the effect of different curing agent concentrations on the electrical and thermal properties of epoxy resin for DC and high frequency applications. Differential scanning calorimetry is used to characterize the thermal performance of the materials. The insulation properties such as breakdown measurements under DC and high frequency stress, DC resistivity, and space charge distributions at different temperatures, and dielectric spectroscopy at different frequencies and temperatures are performed. Results reveal that high curing agent concentrations optimize the thermal and electrical performance of epoxy resin insulation. However, high frequency stress severely degrades the breakdown and dielectric properties of all the prepared materials. By the control of resin stoichiometry, epoxy resin with suitable electrical and thermal properties can be realized for high frequency applications.
Revolutionizing High‐Temperature Electrical Properties of Epoxy Resin via Tailoring Weak Conjugation Rigid Structures

Jie Li,Boya Zhang,Xuanjie Zhang,Yixuan Li,Kaixuan Li,Tianyu Wang,Xingwen Li

DOI: https://doi.org/10.1002/smll.202407579

IF: 13.3

2024-11-24

Small

Abstract:Two classes of curing agents that enable polymers to exhibit balanced thermal and insulation properties with functional bridging groups. There is a weak conjugation system in highly thermally stable epoxy with aromatic backbone, using electron‐modulating bridging groups to immobilize intramolecular charges by tailoring trap sites, and bulky bridging groups to prevent molecular stacking to inhibit intermolecular charge transport. The escalating demand for high‐power and compact‐size advanced electronic devices and power systems necessitates polymers to exhibit superior electrical properties even under harsh environments. However, reconciling the seemingly contradictory attributes of excellent electrical properties and thermal stability poses a formidable challenge for current epoxy polymer (EP) materials and their applications. To meet the need, here two classes of bi‐aryl diamine curing agents are described that enable polymers to exhibit well‐balanced thermal and dielectric properties with functional bridging groups. A weak conjugation system in highly thermally stable polymers with an aromatic backbone is constructed, using electron‐modulating bridging groups to immobilize intramolecular free carriers by tailoring trap sites, and bulky bridging groups to prevent molecular stacking to inhibit intermolecular charge transport. The resultant polymer exhibits a volume resistance of 7.45 × 1012 Ω m and a direct current breakdown strength of 368.74 kV mm−1 at 120 °C, which are 2.2 and 2.4 times higher than that of commercial anhydride‐cured EP, respectively. It is demonstrated to be due to the inhibition of charge injection and transport. The proposed aromatic amine multimolecule approach, combined with diverse functional bridging groups, is a promising direction for exploring next‐generation EP insulation materials suitable for extreme conditions.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Modulating cross-linked network structure of epoxy resin blends towards concurrently high intrinsic thermal conductivity and dielectric properties

Jingyu Di-wu,Wenying Zhou,Yun Wang,Ying Li,Yaodong Liang,Ruotong Zhang,Xiangchuan Meng,Chuanrui Song,Yiru Wang,Qingguo Chen

DOI: https://doi.org/10.1007/s10965-024-04042-z

IF: 3.061

2024-06-19

Journal of Polymer Research

Abstract:High thermal conductivity ( k ) epoxy resin (EP) composites are widely used in electronic devices and power equipment where timely heat dissipation is urgently desirable. However, achieving a balance between high-k values and excellent dielectric properties such as breakdown strength ( E b ) is challenging, which subsequently affects their applications in high-voltage fields. Enhancing the intrinsic k of cured EP is the key to addressing this dilemma. Along this line, in this work, a liquid crystal (LC) epoxy (LCE, BE) with biphenyl mesogenic unit was synthesized and introduced into commonly used EP E-51 to currently promote the k and E b of the blends. The findings demonstrate that the EP blends' k increases with the BE loading due to the formation of multi-scale ordered domains resulting from the self-assembly of biphenyl mesogenic units, which establish the heat-conductive channels for phonon transport. These ordered domains further induce charge traps and efficiently impede the migration of charge carriers. So, the simultaneous enhancement of k and E b along with low dielectric permittivity and loss are achieved in the E-51/BE blends. Moreover, two curing agents also affect the structure, thermal and dielectric performances of the blends. The prepared BE/E-51 blends with enhanced k and E b showcase potential applications as thermal management materials in microelectronic devices and electrical power systems.

polymer science
Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst

Miyuki Harada,Takuya Matsumoto

DOI: https://doi.org/10.3390/cryst14010047

IF: 2.7

2023-12-29

Crystals

Abstract:Improvements in the performance of electronic devices necessitate the development of polymer materials with heat dissipation properties. Liquid crystalline (LC) epoxies have attracted attention because of the orientation of their polymer network chains and their resultant high thermal conductivity. In this study, a diglycidyl ether of 1-methyl-3-(4-phenylcyclohex-1-enyl)benzene was successfully synthesized as an LC epoxy and the LC temperature range was evaluated via differential scanning calorimeter (DSC). The synthesized LC epoxy was cured with m-phenylenediamine (m-PDA) as an amine-type curing agent and 1-(2-cyanoethyl)-2-undecylimidazole (CEUI) as a latent curing catalyst, respectively. The LC phase structure and domain size of the resultant epoxy thermosets were analyzed through X-ray diffraction (XRD) and polarized optical microscopy (POM). High thermal conductivity was observed in the m-PDA system (0.31 W/(m·K)) compared to the CEUI system (0.27 W/(m·K)). On the other hand, in composites loaded with 55 vol% Al2O3 particles as a thermal conductive filler, the CEUI composites showed a higher thermal conductivity value of 2.47 W/(m·K) than the m-PDA composites (1.70 W/(m·K)). This difference was attributed to the LC orientation of the epoxy matrix, induced by the hydroxyl groups on the alumina surface and the latent curing reaction.

materials science, multidisciplinary,crystallography
Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Xuerong Fan,Zheng Liu,Shuangshuang Wang,Junwei Gu

DOI: https://doi.org/10.1002/sus2.172

2023-12-09

SusMat

Abstract:A novel fluorine‐containing liquid crystal epoxy cured resins (TFSAEy/DDM) have the optimal comprehensive properties, such as a low ε value, highly intrinsic λ value, excellent mechanical properties, outstanding heat resistance, wear resistance and flame retardancy, which would replace conventional epoxy resins (E‐51/DDM) in the high‐heating electronic component packaging and printed circuit boards. Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient cannot meet the current application requirements of advanced electronic and electrical equipment. Therefore, novel fluorine‐containing liquid crystal epoxy compounds (TFSAEy) with fluorinated groups, biphenyl units, and flexible alkyl chains are first synthesized via amidation and esterification reactions. Then, 4,4′‐diaminodiphenylmethane (DDM) is used as a curing agent to prepare the corresponding fluorine‐containing liquid crystal epoxy resins. The obtained dielectric constant (ε) and dielectric loss (tan δ) values of TFSAEy/DDM at 1 MHz are 2.54 and 0.025, respectively, which are significantly lower than those of conventional epoxy resins (E‐51/DDM, 3.52 and 0.038). Additionally, the intrinsic thermal conductivity coefficient (λ) of TFSAEy/DDM is 0.36 W/(m·K), 71.4% higher than that of E‐51/DDM (0.21 W/(m·K)). Meanwhile, the corresponding elastic modulus, hardness, glass transition temperature, and heat resistance index of TFSAEy/DDM are 5.73 GPa, 0.35 GPa, 213.5°C, and 188.7°C, respectively, all superior to those of E‐51/DDM (3.68 GPa, 0.27 GPa, 107.2°C, and 174.8°C), presenting potential application in high‐heating electronic component packaging and printed circuit boards.
Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: A mini-review

Kunpeng Ruan,Xiao Zhong,Xuetao Shi,Jinjin Dang,Junwei Gu

DOI: https://doi.org/10.1016/j.mtphys.2021.100456

IF: 11.021

2021-09-01

Materials Today Physics

Abstract:Owing to the excellent mechanical properties and thermal stability, outstanding electrical insulation and chemical resistance, as well as easy processing and low cost, epoxy resins are widely used in electronics and electrical fields. However, the intrinsic thermal conductivity coefficients (λ) of the traditional epoxy resins are low, which is far from being able to meet the high thermal conduction/dissipation requirements of high-power electrical equipment or electronic components. By designing and changing the structures of molecules and chain links to obtain special physical structures (such as orientation structure, liquid crystal structure and crystalline structure, etc.), the high intrinsic λ of epoxy resins can be achieved. This paper reviews the classification, preparation methods, research progresses and thermal conduction mechanisms of intrinsically thermally conductive liquid crystal epoxy resins. The research progresses and academic achievements of existing intrinsically thermally conductive liquid crystal epoxy resins and their composites are focused on, and the influencing factors on the intrinsic thermal conductivities of liquid crystal epoxy resins are discussed. Finally, the development trends and prospects of intrinsically thermally conductive liquid crystal epoxy resins and their composites are pointed out.

materials science, multidisciplinary,physics, applied
High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study

Shouhang Li,Xiaoxiang Yu,Hua Bao,Nuo Yang

DOI: https://doi.org/10.1021/acs.jpcc.8b02001

2018-05-30

The Journal of Physical Chemistry C

Abstract:The ultralow thermal conductivity (∼0.3 W m–1 K–1) of amorphous epoxy resins significantly limits their applications in electronics. Conventional top-down methods, e.g., electrospinning, usually result in the aligned structure for linear thermoplastic polymers, thus satisfactory enhancement on thermal conductivity, but they are deficient for thermoset epoxy resin polymerized by monomers and curing agent due to completely different cross-linked network structure. Here, we proposed a bottom-up strategy, namely, parallel-linking method, to increase the intrinsic thermal conductivity of bulk epoxy resin. Through equilibrium molecular dynamics simulations, we reported on a high thermal conductivity value of unstretched parallel-linked epoxy resin as 0.80 W m–1 K–1, more than 2-fold higher than that of amorphous structure. Furthermore, by applying uniaxial tensile strains along the intrachain direction, a further enhancement in thermal conductivity was obtained, reaching 6.45 W m–1 K–1. Interestingly, we also observed that the interchain thermal conductivities decrease with increasing strain. The single chain of epoxy resin was also investigated and, surprisingly, its thermal conductivity was boosted by 30 times through tensile strain, as high as 33.8 W m–1 K–1. Our study may provide a new insight into the design and fabrication of epoxy resins with a high thermal conductivity.

chemistry, physical,nanoscience & nanotechnology,materials science, multidisciplinary
Tuning Interfacial Characteristics of Epoxy Composites Towards Simultaneous High Thermal and Dielectric Properties

Chengzhi Zhong,Yang Feng,Bin Zhou,Peiyan Liu,Yi Zhao,Shengtao Li

DOI: https://doi.org/10.1002/macp.202400260

IF: 2.996

2024-11-05

Macromolecular Chemistry and Physics

Abstract:This study reports a more detailed and intuitive understanding of the interfacial effect on thermal conductivity and electric properties. The results revealed that the tight chemical interface facilitates the heat transfer in the direction perpendicular to the interface. Additionally, a larger electrostatic potential between interfacial molecules, consistent with the zeta potential, indicates a stronger electrostatic force on charge carriers at the chemical interface. Achieving excellent thermal and dielectric performance is crucial to prevent premature insulation failure of epoxy in high‐frequency transformers. However, interfaces introduced by embedding micro/nano fillers in epoxy have opposite effects on these properties. Here, the interfacial characteristics of micro‐BN/nano‐Al2O3 epoxy is tailored composites by modifying nano‐Al2O3 with functional amine groups, leading to simultaneous improvements in thermal conductivity and high‐frequency breakdown strength. After modification, thermal conductivity increased from 0.193 to 0.490 W m−1 K−1 at 25 °C, and breakdown strength improved from 85.4 to 94.8 kV mm−1 at 10 kHz. The findings revealed the coexistence of overlapping interfaces between micro‐BN and chemical interfaces between modified Al2O3‐NH2 and matrix in composites. Contrary to the overlapping interface, the chemical interface played a more pivotal role in macroscopic performance. Calculations based on a covalent bonding interfacial model demonstrated that this in‐situ tight interface facilitated phonon transport, thereby enhancing thermal conductivity. Besides the physical structure, an increase in electrostatic potential in the chemical interface also impeded charge migration, resulting in an improved breakdown strength. The synergistic effect of the chemical interface on thermal and dielectric properties presents a promising design strategy for developing high‐performance epoxy composites.

polymer science
Biobased Epoxy Resin with Low Electrical Permissivity and Flame Retardancy: From Environmental Friendly High-Throughput Synthesis to Properties

Cheng Li,Hong Fan,Tariq Aziz,Carla Bittencourt,Linbo Wu,De-Yi Wang,Philippe Dubois

DOI: https://doi.org/10.1021/acssuschemeng.8b01212

2018-05-16

Abstract:Recent years have witnessed significant advances in biobased epoxy resins to replace their petroleum-based counterparts, especially diglycidyl ether of bisphenol A type epoxy resin (DGEBA). However, for meeting a great variety of the requirements, long-standing challenges include environmentally friendly preparation of epoxy resin with few toxic byproducts and improving their properties. Herein, we report a facile method to synthesize new silicone-bridged difunctional epoxy monomers in high yield. They are derived from naturally occurring eugenol by introducing the methylsiloxane and phenylsiloxane linkers of different chain lengths into their molecular backbones. These synthesized liquid epoxy monomers have definitive molecular structure with high purity. These silicone-bridged difunctional epoxy monomers exhibit much lower viscosity (<2.5 Pa s) than commercial DGEBA epoxy (10.7 Pa s) suitable for composites and prepregs. After curing, they exhibit a dielectric permittivity as low as 2.8 and good intrinsic flame retardancy with LOI value higher than 31, far outperforming DGEBA. All these advantages are stemmed from their siloxane-contained segments characterized by low polarity, very high dissociation energy, helical molecular structure, and high molecular volume. Overall, this work provides a very facile and scalable route access to a family of the multifunctional eugenol-based epoxy monomers with low dielectric constant and enhanced flame retardancy.

chemistry, multidisciplinary,engineering, chemical,green & sustainable science & technology
Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Taeyoon Lim,Jeseung Yoo,Hyuk Park,Sabah Ansar,Iqra Rabani,Young-Soo Seo

DOI: https://doi.org/10.1039/d4dt00979g

IF: 4

2024-06-01

Dalton Transactions

Abstract:Polymer-like dielectrics with superb thermal conductivity as well as high dielectric properties hold great promise for the modern electronic field. Nevertheless, integrating these properties into a single material simultaneously remains problematic due to their mutually limited physical connotations. In this study, we developed high-quality thermally conductive epoxy composites with excellent dielectric properties. This was achieved by incorporating surface-functionalized microscale hexagonal boron nitride (BN) along with N -[3-(Trimethoxysilyl)propyl]ethylene diamine (DN) and N -[3-(Trimethoxysilyl)propyl]aniline (PN). In the resulting epoxy composite, microscale BN serves as the primary building block for establishing the thermally conductive network, while silica particles act as bridges to regulate heat transfer and reduce interfacial phonon-scattering. The prepared composites were thoroughly examined across various filler contents (ranging from 10 to 80 wt%). Among them, the DNBN/epoxy composite exhibited higher thermal conductivity (in-plane: 47.03 W m −1 K −1 ) at 60 wt% filler content compared to BN/epoxy (39.40 W m −1 K −1 ) and PNBN/epoxy (33 W m −1 K −1 ) composites. These results highlight the usefulness of surface modification of BN in improving compatibility between fillers and epoxy, ultimately reducing composite viscosity. Furthermore, the DNBN/epoxy composite at 60 wt% demonstrated superb dielectric constant (∼6.15) without compromising on dissipation loss (∼0.06). The strategy adopted in this study offers significant insights into designing dielectric thermally conductive composites with superior performance outcomes.

chemistry, inorganic & nuclear
Highly Conductive Polymer Composites from Room-Temperature Ionic Liquid Cured Epoxy Resin: Effect of Interphase Layer on Percolation Conductance

Xinfeng Zhang,Hongye Sun,Chen Yang,Kai Zhang,Matthew M. F. Yuen,Shihe Yang

DOI: https://doi.org/10.1039/c2ra23027e

IF: 4.036

2013-01-01

RSC Advances

Abstract:An ionic liquid type imidazolium catalyst enhanced the conductivity of epoxy-anhydride resin based electrical conductive adhesives (ECAs) by more than two orders of magnitude compared with common imidazole compounds. Percolation growth dynamics study combining with epoxy curing kinetics results indicates that the enhancement of conductivity was attributed to the higher percolation efficiency within ionic liquid catalyzed ECAs. An "interphase layer'' model was proposed to explain the percolation mechanism in the thermoset based conductive composite. The present work highlights the importance of cross-linking the polymer matrix with filler interconnections, and provides practical guidance on the control over percolation dynamics in conductive composites in order to achieve enhanced percolation conductivity.
A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

Yalan Wu,Xuerong Fan,Zhen Wang,Zhiming Zhang,Zheng Liu

DOI: https://doi.org/10.1002/pat.6241

IF: 3.348

2023-11-25

Polymers for Advanced Technologies

Abstract:Epoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant (ε) and dielectric loss (tanδ) of common epoxy resins are relatively high (ε for 3.8–4.2; tanδ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tanδ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tanδ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.

polymer science
A Fully Polydicyclopentadien Skeletonized Epoxy Resin System and their Fundamental Properties as Electronic Materials

Yuqing Li,Peng Zhao,Xiongtao Ju,Shutong Jiang,Long Zhang,Jianhua Li,Shun Li,Xu Li,Jianming Zhang

DOI: https://doi.org/10.1039/d4cc05871b

IF: 4.9

2024-11-28

Chemical Communications

Abstract:A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resins counterparts, the cured DCPD-based resin demonstrates excellent thermal properties (Tg > 250 °C) and low dissipation factors (0.0065 at 10 GHz), indicating its potential as a promising thermoset in high-performance electronic applications.

chemistry, multidisciplinary
Low K Epoxy Resin Containing Cycloaliphatic Hydrocarbon with High Crosslinking Density

Lingqiang Kong,Yuanrong Cheng,Yunxia Jin,Tianke Qi,Fei Xiao

DOI: https://doi.org/10.1002/app.43456

IF: 3

2016-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTHigh performance epoxy resins have attracted much research interest in the last decades. Herein, two novel epoxy monomers containing cycloaliphatic hydrocarbon, 1,4‐bis(4‐(N,N‐diglycidylamino)phenoxy)cyclohexane (CyhEP) and 1,3‐bis(4‐(N,N‐diglycidylamino)phenoxy)adamantane (AdaEP) were synthesized and characterized. They were cured with 4‐methylhexahydrophthalic anhydride (MHHPA) to prepare the highly crosslinked thermosets. Both epoxy resins show good thermal stability (Td5 > 300 °C), high glass transition temperature (> 200 °C), and high storage modulus (> 3.2 GPa) due to their highly crosslinked structure. The AdaEP/MHHPA resin shows a low dielectric constant (3.4 at 1 MHz) because of the introduction of bulky rigid adamantane into the polymer. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 43456.
Synergistic effect of multiscale BNs/CNT and 3D melamine foam on the thermal conductive of epoxy resin

Jiamei Luo,Xueqin Yang,Rogers Tusiime,Haonan Chen,Yong Liu,Hui Zhang,Jianyong Yu

DOI: https://doi.org/10.1016/j.coco.2021.101044

IF: 8

2022-01-01

Composites Communications

Abstract:High heat conduction epoxy resins with a more than twofold increase in thermal conductivity at a low filler addition were fabricated by construction of three-dimensional synergistic thermal conductive networks at macro and micro scales. Shortly, boron nitride nanoplates/carbon nanotubes (BNs/CNT) were embedded into each other and assembled on 3D melamine foam skeletons via electrostatic interaction, prior to addition of epoxy resin. The introduced melamine foam has the characteristics of strong adsorption and ultra-high porosity, which are convenient for BNs/CNT to establish multiscale synergistic heat conduction channels at a microscopic scale. The morphological characteristics of M(BNs/CNT)x were revealed by FESEM and elemental mapping images pointed to continuous BNs/CNT thermal paths forming along the 3D skeleton of the melamine foam within epoxy resin. Consequently, the thermal conductivity of the epoxy resin improved from 0.21 W m−1 K−1 to 0.43 W m−1 K−1 at a rather low filler content of BNs/CNT (about 0.43 wt%, ∼1/1). The epoxy resin further possessed a relatively low dielectric constant (about 7.38 at frequency = 107 Hz) as suggested by dielectric characteristic analysis. This presents promising application prospects in the field of electrical insulation materials.

materials science, composites
Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging

Zhengdong Wang,Ganqiu Yang,Xiaolong Cao,Mengli Li,Tong Zhang,Chenxin Liu,Yuanhang Zhou,Yonghong Cheng

DOI: https://doi.org/10.1049/hve2.12443

IF: 4.967

2024-04-19

High Voltage

Abstract:Internal insulation of high‐voltage power modules is facing interesting failure risks, including high temperature overheating, breakdown fault, material cracking etc., so it is imperative to urgently develop new dielectric materials with high thermal conductivity (λ), outstanding electrical insulation, and thermal stability properties. A method to construct controllable liquid crystalline cross‐linking networks based on the synthesis of biphenyl epoxy monomer and the change of curing agent structures and curing temperature is proposed. The uniform nematic rod‐like liquid crystalline domains were obtained by using 4,4‐diaminodiphenylmethane as a curing agent under a pre‐curing temperature of 105°C. The resulting film (abbreviated as TD‐105) exhibited λ up to 0.53 W m−1 K−1 and a dielectric breakdown strength of 57.69 kV mm−1, which showed a simultaneous enhancement of 178% and 16%, respectively, compared to traditional bisphenol A epoxy resin. Moreover, it also exhibited lower dielectric loss and magnitude of partial discharge while having higher glass‐transition temperature (190°C). A novel idea for the development of high‐performance epoxy insulating materials for the application of high‐voltage and large‐power electrical equipment is provided.

engineering, electrical & electronic
Enhance the thermal conductivity and maintain insulation property of epoxy via constructing a three-dimensional network by doping hexagonal boron nitride and carbon nanofiber

Zhanyi Wang,Xuan Wang,Maoyuan Sun,Liang Liang,Hongda Yang,Yiheng Li,Kailun Yang

DOI: https://doi.org/10.1007/s10854-021-07269-4

2021-10-30

Abstract:It is of great significance for polymers used in electrical systems to maintain insulation property while improving the thermal conductivity of them. In order to achieve this goal, this paper used hexagonal boron nitride (h-BN) and a small amount of carbon nanofibers (CNF) as filling phase, prepared thermally conductive insulating dielectric materials based on epoxy. An effective heat transport network is formed in the material by the synergistic effect of the two-dimensional structure of h-BN and the one-dimensional structure of CNF, thereby improving the thermal conductivity of the composite materials. The thermal conductivity of the composite with the filling amount of 20 phr h-BN & 0.001 phr CNF reached 0.505 W/(m K), which is 188.6% higher than that of pure epoxy. At the same time, the composites also exhibited higher insulating strength under DC conditions and lower tangent of the dielectric loss angle in a wide frequency range. This simple mixing strategy provides a new way for the preparation and research of thermally conductive and insulating polymer materials.
Influence of dielectric barrier effect and thermally‐conductive network on thermal and electrical properties of epoxy under different frequencies and temperatures

Muhammad Awais,Xiangrong Chen,Yiwen Shi,Qilong Wang,Guangyu Zhu,Fan‐Bo Meng,Zelin Hong,Ashish Paramane

DOI: https://doi.org/10.1002/app.53271

IF: 3

2022-10-30

Journal of Applied Polymer Science

Abstract:Enhancement mechanism of thermal conductivity and dielectric breakdown strength. Epoxy resin (EPR) insulations play a vital role in the insulation of modern power electronic equipment owing to their excellent dielectric properties. However, due to the high‐power density and miniaturization of power equipment which causes high heat fluxes under high voltage and high‐frequency stresses, EPR with good thermal and insulation properties is urgently needed. In this study, the polydopamine functionalized micro‐BN and core‐shell nano TiO2–SiO2 particles are dispersed in EPR to simultaneously improve thermal and dielectric insulation properties. It is revealed that the addition of micro‐nano particles significantly improves the thermal and dielectric performance. Particularly, the high thermal conductivity of micro‐BN and the dielectric barrier effect due to the core‐shell structure of nano TiO2–SiO2 are the main reasons for improved thermal and dielectric insulation performance, respectively. The EPR composite containing 3 wt% of micro‐BN and 1 wt% of nano TiO2–SiO2 exhibits the optimal performance with 0.49 W/mK thermal conductivity and the highest dielectric strength among all the samples, that is, 60.61 kV/mm even at 10 kHz and 90°C. This study found that the crucial factors are the surface encapsulation, weight percent, and homogeneous dispersion of particles in EPR, the dielectric barrier effect, thermal conductivity, and the mismatch between the dielectric constant of EPR and particles. This study proposes the optimal weight percent of suitable micro‐nano particles for EPR to produce suitable composites for high‐frequency and high‐temperature applications.

polymer science
Study on copolymerization modification and properties of bio-based trifunctional diphenolic acid epoxy resin by CE and DPR

Junji Wei,Yajun Duan,Hao Wang,Wanping Zhang

DOI: https://doi.org/10.1016/j.polymer.2023.126308

IF: 4.6

2023-10-01

Polymer

Abstract:Diphenolic acid epoxy resin (DPAE), a new type of bio-based epoxy, exhibits many attractive performances, such as high reactivity, low expansion coefficient (CTE), high glass transition temperature (T g) and high storage modulus. However, the dielectric constant of DPAE is not satisfied for the requirements of high frequency circuit field, which need to be further improved to expand its application in emerging area of electronic information. In this work, both dicyclopentadiene phenol epoxy resin (DPR) and cyanate ester (CE) were used to modify DPAE in order to improve its dielectric property, while keeping good heat resistance and low dimensional stability. Furthermore, the influence of curing agent types on properties of DPAE/DPR system was studied. Compared with DPAE resin, both DPAE/DPR and DPAE/CE composites exhibited higher glass transition temperature (T g), lower dielectric constant, lower loss tangent with good compatibility between DPAE and those two resins. Moreover, CE resin exhibited better modified effect than DPR on thermal and dielectric properties of DPAE with the same addition. For example, the dielectric constant and loss tangent of DPAE/CE with 50 wt% CE were as low as 3.4 and 0.018 at 1 MHz, respectively.

polymer science

Gastrin and somatostatin in the rat antrum. The effect of removal of acid-secreting mucosa

Highly Thermal Conductive Benzoxazine‐epoxy Interpenetrating Polymer Networks Containing Liquid Crystalline Structures

Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

Revolutionizing High‐Temperature Electrical Properties of Epoxy Resin via Tailoring Weak Conjugation Rigid Structures

Modulating cross-linked network structure of epoxy resin blends towards concurrently high intrinsic thermal conductivity and dielectric properties

Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst

Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: A mini-review

High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study

Tuning Interfacial Characteristics of Epoxy Composites Towards Simultaneous High Thermal and Dielectric Properties

Biobased Epoxy Resin with Low Electrical Permissivity and Flame Retardancy: From Environmental Friendly High-Throughput Synthesis to Properties

Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Highly Conductive Polymer Composites from Room-Temperature Ionic Liquid Cured Epoxy Resin: Effect of Interphase Layer on Percolation Conductance

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

A Fully Polydicyclopentadien Skeletonized Epoxy Resin System and their Fundamental Properties as Electronic Materials

Low K Epoxy Resin Containing Cycloaliphatic Hydrocarbon with High Crosslinking Density

Synergistic effect of multiscale BNs/CNT and 3D melamine foam on the thermal conductive of epoxy resin

Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging

Enhance the thermal conductivity and maintain insulation property of epoxy via constructing a three-dimensional network by doping hexagonal boron nitride and carbon nanofiber

Influence of dielectric barrier effect and thermally‐conductive network on thermal and electrical properties of epoxy under different frequencies and temperatures

Study on copolymerization modification and properties of bio-based trifunctional diphenolic acid epoxy resin by CE and DPR