Abstract:It is a traditional method to improve the thermal conductivity of matrix by adding fillers. However, it is a great challenge to construct a dense heat conduction network in composite material. The current researches on building thermal conductive network is to combine different fillers through structure design for achieving high thermal conductivity with the lowest possible filler content. Due to the electrical insulation requirements of electronic equipment, hexagonal boron nitride (h-BN) has been extensively studied as an inorganic thermal conductive filler. It has a layer structure that shows a relatively high TC of 300 W.m(-1).K-1 in the h-BN planar direction. In this study, the foam was introduced into the epoxy resin as a skeleton, and thermal conductive network was constructed by immersing the BN/E51 mixture into the foam. By comparing the hot deformation behavior of two kinds of foams with different structures and compositions: polyurethane foam (PF) and nano-melamine (melamine) foam (MF), epoxy resin-based composites with high thermal conductivity were obtained by hot press curing under the right compression ratio. PF has a large single arm size and good elastic deformation ability, but it is easy to become a barrier between BN, which is bad for forming thermal conductive path after compression. However, MF has a small single arm size and can be broken into four needle-like scaffold structures after compression. The needle-like scaffold structure promotes the good dispersion of BN, and finally forms a thermal path of BN throughout the material, which plays a key role in improving the thermal conductivity of the composite. As a result, MF-BN/E51 showed an excellent thermal conductivity of 3.88 W.m(-1).K-1 at 41 wt% BN load when the degree of hot pressing was 90%. It provides a new way for the composites to achieve a higher thermal conductivity with a less filler load.

Synergistic effect of multiscale BNs/CNT and 3D melamine foam on the thermal conductive of epoxy resin

Improving Thermal Conductivity of Epoxy Resin by Filling Boron Nitride Nanomaterials: A Molecular Dynamics Investigation

Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading

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Development of high thermally conductive and electrically insulated epoxy nanocomposites with high mechanical performance

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Development of high thermal conductivity via BNNTs/epoxy/organic-Si hybrid composite systems