A Fully Polydicyclopentadien Skeletonized Epoxy Resin System and their Fundamental Properties as Electronic Materials

Yuqing Li,Peng Zhao,Xiongtao Ju,Shutong Jiang,Long Zhang,Jianhua Li,Shun Li,Xu Li,Jianming Zhang
DOI: https://doi.org/10.1039/d4cc05871b
IF: 4.9
2024-11-28
Chemical Communications
Abstract:A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resins counterparts, the cured DCPD-based resin demonstrates excellent thermal properties (Tg > 250 °C) and low dissipation factors (0.0065 at 10 GHz), indicating its potential as a promising thermoset in high-performance electronic applications.
chemistry, multidisciplinary
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