Abstract:Epoxy polymer-based dielectric materials play a crucial role in advanced electronic devices and power equipment. However, high voltage-stress applications impose stringent requirements, such as a high dielectric strength, on epoxy polymers. Previously reported studies have shown promising material architectures in the form of epoxy polymer–nanoparticle dielectrics, which can restrict the movement of high-energy electrons by the interface charge traps associated with the various interfacial regions. However, these high-energy electrons inevitably traverse the epoxy polymer matrix and destroy the molecular structure, thereby creating a weak link for dielectric breakdown. In this study, a general strategy is developed to improve the dielectric strength by constructing interface charge traps in the molecular structure of the epoxy polymer matrix, using the −CF3 group in partial replacement of the −CH3 group. The proposed strategy increases the dielectric strength (39.5 kV mm–1) and surface breakdown voltage (26.9 kV) of the epoxy polymer matrix by 22.08% and 13.3%, respectively, because the interface charge trap hinders the movement of high-energy electrons. At the same time, the strategy does not degrade the mechanical and thermal properties. The results hold potential for wide application in the manufacturing of advanced future electrical and electronic equipment requiring resilience to high-voltage stress.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01933?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01933</a>.Principles of constructing charge traps; effect of interface charge traps on mulliken charge population of epoxy resins; synthesis method of epoxy resin containing interface charge traps; viscosity and epoxy value of epoxy resins; FT-IR spectrum of epoxy resins; preparation method of epoxy polymers; surface electrostatic potential of epoxy polymers; space charge of epoxy polymers; surface potential attenuation test method of epoxy polymers; molecular orbital energy levels and density of states of epoxy polymers; surface breakdown time test method of epoxy polymers; mechanical and thermal properties of epoxy polymers; dielectric constant and dielectric loss of epoxy polymers; and insulation and mechanical properties of Al2O3/EP composites (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01933/suppl_file/am1c01933_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

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