Modulating cross-linked network structure of epoxy resin blends towards concurrently high intrinsic thermal conductivity and dielectric properties

Jingyu Di-wu,Wenying Zhou,Yun Wang,Ying Li,Yaodong Liang,Ruotong Zhang,Xiangchuan Meng,Chuanrui Song,Yiru Wang,Qingguo Chen
DOI: https://doi.org/10.1007/s10965-024-04042-z
IF: 3.061
2024-06-19
Journal of Polymer Research
Abstract:High thermal conductivity ( k ) epoxy resin (EP) composites are widely used in electronic devices and power equipment where timely heat dissipation is urgently desirable. However, achieving a balance between high-k values and excellent dielectric properties such as breakdown strength ( E b ) is challenging, which subsequently affects their applications in high-voltage fields. Enhancing the intrinsic k of cured EP is the key to addressing this dilemma. Along this line, in this work, a liquid crystal (LC) epoxy (LCE, BE) with biphenyl mesogenic unit was synthesized and introduced into commonly used EP E-51 to currently promote the k and E b of the blends. The findings demonstrate that the EP blends' k increases with the BE loading due to the formation of multi-scale ordered domains resulting from the self-assembly of biphenyl mesogenic units, which establish the heat-conductive channels for phonon transport. These ordered domains further induce charge traps and efficiently impede the migration of charge carriers. So, the simultaneous enhancement of k and E b along with low dielectric permittivity and loss are achieved in the E-51/BE blends. Moreover, two curing agents also affect the structure, thermal and dielectric performances of the blends. The prepared BE/E-51 blends with enhanced k and E b showcase potential applications as thermal management materials in microelectronic devices and electrical power systems.
polymer science
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