Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

M. Awais,C. Dai,F. B. Meng,A. Paramane,X. Wang,X. Chen
DOI: https://doi.org/10.1049/icp.2022.0035
2021-01-01
Abstract:Epoxy resin insulations are considered as a potential candidate for various applications like transformers, cable terminations, power electronic device packaging, and bushings. This has promoted a great interest in their use as high voltage insulation materials for high frequency applications. This work presents the effect of different curing agent concentrations on the electrical and thermal properties of epoxy resin for DC and high frequency applications. Differential scanning calorimetry is used to characterize the thermal performance of the materials. The insulation properties such as breakdown measurements under DC and high frequency stress, DC resistivity, and space charge distributions at different temperatures, and dielectric spectroscopy at different frequencies and temperatures are performed. Results reveal that high curing agent concentrations optimize the thermal and electrical performance of epoxy resin insulation. However, high frequency stress severely degrades the breakdown and dielectric properties of all the prepared materials. By the control of resin stoichiometry, epoxy resin with suitable electrical and thermal properties can be realized for high frequency applications.
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