Flexible Integrated Circuits Based on Carbon Nanotubes
Youfan Hu,Lian-Mao Peng,Li Xiang,Heng Zhang
DOI: https://doi.org/10.1021/accountsmr.0c00020
2020-01-01
Accounts of Materials Research
Abstract:Flexible integrated circuits, working as the core unit of information processing, have been a subject of extensive research; they are essential to realize fully flexible electronic systems, which possess advantages over the current hybrid flexible systems (part or all based on rigid silicon chips) because of their extended application forms, better adaptability, and greater ability to operate at biotic/abiotic interfaces. To a great extent, the deliverable functionality of the ultimate integrated system is determined by the information handling capability of flexible integrated circuits, which is highly dependent on their performance and integration scale. Additionally, as the applications of flexible electronic systems become increasingly favorable in portable, wearable, or remote forms with a restrained power supply, the power dissipation of flexible integrated circuits becomes crucial, as they consume considerable energy in a system. Due to the restricted fabrication circumstances on flexible substrates with a low thermal budget and complex working environments (from the perspectives of both mechanical and electrical conditions), pursuing flexible integrated circuits with high performance, decent integration scale, and low power consumption is very challenging, but it is necessary for advanced, fully flexible systems. Other characteristics, such as biocompatibility, degradability, and configurability, would add value to flexible integrated circuits and introduce unconventional forms and new deliverables for flexible electronics. In this Account, we summarize our efforts toward developing carbon nanotube-based flexible integrated circuits over the past five years. As promising candidates for constructing next-generation chips, carbon nanotube-based integrated circuits have demonstrated their superiority in performance and power consumption, and we extend these advancements to a flexible form through material optimization, device design, processing technology development, etc. We start with a brief introduction to carbon nanotube properties to reveal their intrinsic advantages as channel materials for next-generation electronics. Next, we discuss the manufacturing methods we developed to construct integrated circuits on flexible substrates via a direct fabrication or transfer process to maintain these advantages and fit the circuits to different application circumstances. Then, demonstrations of carbon nanotube-based flexible integrated circuits with different forms and characteristics are presented, including (1) the implantation of complementary metal-oxide-semiconductor circuits on ultrathin substrates with high performance, (2) transferrable integrated circuits with a biointegration capability and low power consumption, (3) degradable integrated circuits manufactured at the wafer scale with a high yield and high uniformity, and (4) configurable integrated circuits with multiple functions. Integrated flexible sensor systems constructed with some of these circuits have also been introduced. Finally, we end the Account with an overview of the remaining challenges and new opportunities that have been opened up for carbon nanotubes in flexible integrated circuits and new forms of electronics.