High‐Performance P‐Channel Tin Halide Perovskite Thin Film Transistor Utilizing a 2D–3D Core–Shell Structure

Junghwan Kim,Yu‐Shien Shiah,Kihyung Sim,Soshi Iimura,Katsumi Abe,Masatake Tsuji,Masato Sasase,Hideo Hosono
DOI: https://doi.org/10.1002/advs.202104993
IF: 15.1
2021-12-19
Advanced Science
Abstract:Metal halide perovskites (MHPs) are plausible candidates for practical p-type semiconductors. However, in thin film transistor (TFT) applications, both 2D PEA<sub>2</sub> SnI<sub>4</sub> and 3D FASnI<sub>3</sub> MHPs have different drawbacks. In 2D MHP, the TFT mobility is seriously reduced by grain-boundary issues, whereas 3D MHP has an uncontrollably high hole density, which results in quite a large threshold voltage (V<sub>th</sub> ). To overcome these problems, a new concept based on a 2D-3D core-shell structure is herein proposed. In the proposed structure, a 3D MHP core is fully isolated by a 2D MHP, providing two desirable effects as follows. (i) V<sub>th</sub> can be independently controlled by the 2D component, and (ii) the grain-boundary resistance is significantly improved by the 2D/3D interface. Moreover, SnF<sub>2</sub> additives are used, and they facilitate the formation of the 2D/3D core-shell structure. Consequently, a high-performance p-type Sn-based MHP TFT with a field-effect mobility of ≈25 cm<sup>2</sup> V<sup>-1</sup> s<sup>-1</sup> is obtained. The voltage gain of a complementary metal oxide semiconductor (CMOS) inverter comprising an n-channel InGaZnO<sub>x</sub> TFT and a p-channel Sn-MHP TFT is ≈200 V/V at V<sub>DD</sub> = 20 V. Overall, the proposed 2D/3D core-shell structure is expected to provide a new route for obtaining high-performance MHP TFTs.
materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
What problem does this paper attempt to address?