Abstract:The proper control of solder heating and melting leads to successful joining of surface-mount technology devices to the metallization of printed circuit boards. When developing new solder alloys for more miniaturized and lower temperature processes, the improved process control for the heating and melting during solder reflow can be beneficial. To find an optimized temperature profile efficiently, it is helpful to know the exact onset times of the physical mechanisms of soldering including sintering, melting, and solidification. In particular, to exactly know the time, the solder remains in the molten state can help to minimize the temperature exposure of sensitive substrates. To this end, we used standard lead-free SAC305 solder and a real-time resistance monitoring setup to observe the in-process resistance during the soldering of a 0805-type chip resistor to find out exact points in time when the soldering mechanisms occur. Cross-sectioning studies and microscopic observations were performed in parallel to explain three distinct resistance drops observed in the resistance signals. Sintering of solder balls resulted in drop 1, the collapse and melting of all the solder balls resulted in drop 2, and the solidification of solder resulted in drop 3, which actually consisted of two separate drops, one for each solder joint of the chip resistor. The observation of the resistance drop due to solder solidification was achieved because our newly improved setup reduced the signal noise to less than 0.012 m Omega (root mean square value). On average, the solder was in a liquid state for 17.6 min +/- 0.18 min (seven samples). The solidification drop was 0.2 m Omega and happened at approximately 200 degrees C, indicating not more than 28 K of undercooling. Such an accurate measurement of melting and solidification times may prove useful in the future when optimizing the reflow temperature profiles for advanced soldering applications, e.g., to minimize the melting-solidification interval on heat-sensitive thin flexible substrates for wearables.

Study on the Failure Mechanism of a Chip Resistor Solder Joint During Thermal Cycling for Prognostics and Health Monitoring

고장예지를 위한 온도사이클시험에서 칩저항 실장솔더의 고장메커니즘 연구

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

Thermal Cycle Failure Behavior of SAC305/SnPb Micro-Hybrid Solder Joints: an Experimental and Finite Element Simulation Approach

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling

The Mechanical Properties Degradation of Solder Joints under Thermal Cycling

The impact of thermal cycling regime on the shear strength of lead‐free solder joints

Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking

Acceleration Reliability Tests for Lead-free Solder Joints under Thermal Cycling Coupling with Current Stressing

Accelerative Reliability Tests for Sn3.0Ag0.5Cu Solder Joints under Thermal Cycling Coupling with Current Stressing

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability

Investigation on failure behaviour of solder joint during thermal fatigue

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

Investigation of Thin Small Outline Package (TSOP) Solder Joint Crack after Accelerated Thermal Cycling Testing

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling

Prediction on Response to the Thermal Fatigue of Through-Hole Solder Joint I. Experimental Research of Solder Joint Response to the Thermal Fatigue

An Improved Substructure Method For Prediction Of Solder Joint Reliability In Thermal Cycle