Abstract:Mask Projection micro-Stereolithography (MPμSL) is an additive manufacturing technique capable of producing solid parts with micron-scale resolution from a vat of photocurable liquid polymer resin. Although the physical mechanism remains the same, the process differs from traditional laser-galvanometer based stereolithography (SL) in its use of a dynamic mask UV projector, or digital light processor (DLP), which cures each location within each 3D layer at the same time. One area where MPµSL has garnered considerable attention is in the field of microfluidics and Lab-on-a-Chip, where complex multistep microfabrication techniques adopted from the semiconductor industry are still widely used, and where MPµSL offers the ability to fabricate completely encapsulated fluidic channels in a single step and at low cost [1–3]. However, a significant obstacle exists in the prevention of channel blockage due to overcuring of the polymer resin [4, 5]. Overcuring can be attributed to the so-called ‘back side effect’ [2] which occurs during the build process as light from successive layers penetrates into the resin to a depth greater than the layer thickness. This effect is most prevalent in channels or features oriented horizontally (in a parallel plane to that of the build platform). Currently there are two main approaches in controlling the cure depth; 1. the chemical approach, which involves doping the resin material with a chemical light absorber [6–8]; and 2. by improving the system's hardware and optical elements to improve the homogeneity of the light dosage and control the cure depth [9]. Here we investigate a third approach through modification of the 3D CAD file prior to printing to mitigate for UV light leakage from successive build layers. Although used here in conjunction with the MPμSL technique, this approach can be applied to a range of SL techniques to improve printer resolution and enable production of internal features with higher dimensional accuracy.

An inexpensive stereolithography technology with high power UV‐LED light

Compact Ultraviolet Light-Emitting Diode-Based Lithography Illumination System with Tunable Coherent Factor

Development and validation of a low-cost UV curing system for Direct Ink Write 3D printers

Development of a Multi-Step Exposure Method for Projection-Based Printing System

High Power-density UV-LED Package Modules and Their Application in Curing

Development Of A Compact And Cost Effective Msl System Based On A Compliant Nanomanipulator

Printing Depth Modeling, Printing Process Quantification and Quick-Decision of Printing Parameters in Micro-Vat Polymerization

Direct ink writing of metal parts with curing by UV light irradiation

Development of Programmable UV-LED Microlithography System for 3D Microfabrication

Stereolithography 3D printing of transparent resin lens for high-power phosphor-coated WLEDs packaging

Multi-step exposure method for improving structure flatness in digital light processing-based printing

Research on the Resolution of Micro Stereo Lithography

Mitigation and control of the overcuring effect in mask projection micro-stereolithography

Microscope Projection Photolithography Based on Ultraviolet Light-emitting Diodes

Research and implementation of large-area sintering technology based on image-shaped laser

Hybrid-Light-Source Stereolithography for Fabricating Macro-Objects With Micro-Textures

Preparation and Study of Stereolithography Photosensitive Resin Based on 405 Nm Uv Light Source

High-Power 365 nm UV LED Mercury Arc Lamp Replacement for Photochemistry and Chemical Photolithography

Light Efficiency Investigation of Ultraviolet Light-Emitting Diodes Combined With Polarized Emission and Packaging Structure

Three-Dimensional Printing of Large Objects with High Resolution by Dynamic Projection Scanning Lithography

Maskless photolithography based on ultraviolet micro-LEDs and direct writing method for improving pattern resolution