High Power-density UV-LED Package Modules and Their Application in Curing

Qiuyi HAN,Siqi LI,Minghao LI,Zhong JING,Shanduan ZHANG

DOI: https://doi.org/10.3969∕j.issn.1004-440X.2017.01.005

2017-01-01

Abstract:The rapid progress of ultraviolet ( UV) LED chip technology pushes UV-LEDs' application in curing field. For the purpose of meeting the requirement of industrial manufacture, high power-density UV-LED package modules are developed based on a sandwich packaging structure consisting of copper and AlN boards. The structure improves the module performances of both the thermal conduction and the current carrying. The parameters of a six-chip package module are: emitting area 0. 6 cm2 , input power 432 W, input power density 720 W · cm-2 , emittance 230 W · cm-2 , radiant efficiency 32%. This leads to the possibility of high-performance and high-power UV-LED curing systems, which have been used in wood-board-painting production lines and optical fibre drawing towers successfully. The results show more than 80% energy saving, and significant production capacity increase, which will bring revolution and opportunity to the UV curing industry.