Analysis and Optimization on Non-uniformity of Temperature Distribution in Hydrophobic Cycloaliphatic Epoxy Resin Insulators during the Curing Process

Yuhao Liu,Ying Lin,Kangning Wu,Haonan Fan,Liming Wang
DOI: https://doi.org/10.1109/tdei.2021.009668
IF: 2.509
2021-10-01
IEEE Transactions on Dielectrics and Electrical Insulation
Abstract:Hydrophobic cycloaliphatic epoxy resin (HCEP) insulators are a new generation of outdoor transmission line insulators with good application prospects. However, the HCEP has obvious curing internal stress due to the uneven internal temperature distribution. In this paper, the curing reaction of HCEP mixture is analyzed and a three-dimensional transient temperature field model of HCEP insulator is established. The internal temperature field of HCEP insulator during curing is analyzed for the first time. The results show that the curing reaction of HCEP mixture conforms to autocatalytic reaction. The structure of umbrella skirt causes the uneven temperature distribution inside HCEP insulator. Based on a surrogate model, it is found that thermal conductivity has a great influence on axial temperature distribution, while curing temperature plays a leading role in curing degree and temperature overshoot. The optimal curing temperature is found according to Pareto front. This paper is beneficial for the theoretical analysis and engineering guidance for manufacture of HCEP insulators.
engineering, electrical & electronic,physics, applied
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