Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

Chuang Wang,Gang Zhou,Qing Sun,Chi Chen,Zaiqin Zhang,Hui Li,ZongRen Peng

DOI: https://doi.org/10.1049/hve2.12206

IF: 4.967

2022-04-04

High Voltage

Abstract:There are many metal and epoxy resin interfacial structures in power equipments, which can generate interfacial stress concentrations and may induce accidents due to epoxy curing. In this paper, through simplifying interface structure into a coaxial cylindrical model, the formation mechanism of interfacial stress concentration of this interface structure was studied during epoxy resin curing process. The strain and temperature at the interface were measured by the strain and temperature measurement system. Then a model for calculating the interface stress distribution was established, including the heat conduction module, curing dynamics module and curing deformation module. The validity of the model was verified by comparing the calculated results with the measured results. In addition, the air gap defects at the interface, appearing after the curing process, were simulated. The results show that, after the curing process, the first principal stress at the centre of the interface gradually increases from the centre to the edge, reaching 41.06 and 40.20 MPa at the upper and lower edges respectively. The existence of air gap leads to partial discharge at low voltage. The calculation model can be extended to the stress prediction between the metal and epoxy resin in other power equipments.

engineering, electrical & electronic