Abstract:Cu-Cu bonding presents an attractive approach to bottom-up manufacturing, facilitating nanoparticle production, linking, and restoration. The ramifications of varying bonding depths and orientations exhibit distinct characteristics. At the same time, investigations into the material composition of nanoscale bonded pairs involve scrutiny of atomic slippage, strain distribution, and the force-displacement profile. The methodology simulates the Cu-Cu bonding process by implementing the quasi-continuum (QC) approach, constituting a multifaceted mixed molecular dynamics technique integrating atomistic and continuum methods. The analysis of results reveals variations in the Contact effect induced by the four orientations, along with discrepancies in the atomic slippage observed in distinct directions. Notably, a pronounced distinction is discernible in the directional movement. Specifically, the strained regions on the flat surface of the lower substrate, characterized by the directionality of X[001]-Y[110], exhibit a notably broader range of atomic slip compared to regions strained by alternative orientations. Furthermore, the directional alignment of X[110]-Y[111] illustrates that irrespective of whether the lower substrate's surface is flat or rough, the orientation of atomic slip diverges. In conclusion, our study employed a quasi-continuous method to explore the bonding efficacy of copper-to-copper interfaces on flat and irregular substrate surfaces. Through this approach, we scrutinized the distributions of strain, stress, average Newtonian force, and atom differential arrangement direction across different orientations.

Promising electroplating solution for facile fabrication of Cu quantum point contacts

Conductance histogram evolution of an EC-MCBJ fabricated Au atomic point contact.

Formation of Atomic Point Contacts and Molecular Junctions with a Combined Mechanical Break Junction and Electrodeposition Method

Extending the Capability of Stm Break Junction for Conductance Measurement of Atomic-Size Nanowires: an Electrochemical Strategy

MOEMS 3D microstructure preparation method based on novel localized electrochemical deposition

Contacting Nanowires and Nanotubes with Atomic Precision for Electronic Transport

Electrostatically Assembled Metallic Point Contacts

Fabrication of quantum point contacts by engraving GaAs/AlGaAs-heterostructures with a diamond tip

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

Study on alkaline and acid-alkaline chemical plating of Cu

Cu Array Fabrication: an Environmentally Sustainable Approach Through Bicontinuous Microemulsion Differential Electrodeposition for Advanced Power Device Packaging

Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment

Formation of Covalent Metal-Carbon Contacts Assisted by Ag+ for Single Molecule Junctions

Pre-selectable integer quantum conductance of electrochemically fabricated silver point contacts

Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding

A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging

Quantum Transport In Metallic Nanowires Fabricated By Electrochemical Deposition/Dissolution

Low Temperature Fine-Pitch Wafer-Level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD

Probing Electronic Transport of Individual Nanostructures with Atomic Precision

Single-Displacement Controlled Spontaneous Electrolysis Towards Cutcnq Microribbon Electrodes in Organic Single-Crystal Transistors