Interfacial reactions between pure indium solder and Au/Ni metallization
Li-Chi Huang,Yan-Ping Zhang,Chih-Ming Chen,Liang-Yih Hung,Yu-Po Wang
DOI: https://doi.org/10.1007/s10854-022-08253-2
2022-05-04
Abstract:Thermal interface material (TIM) attracts considerable attention as the increasing demands for efficient heat dissipation in high-performance microelectronic packages. Due to high thermal conductivity, pure indium is a promising candidate of TIM. The TIM joint between two adjoining components is constructed by solid–liquid interdiffusion (SLID) reaction between indium and Au/Ni metallization on the adjoining surfaces. An understanding of the formation and growth kinetics of the intermetallic compounds (IMCs) at the In/Au/Ni interface is crucial for the reliability assessment of the TIM joints. In this study, the interfacial reactions between indium and Au/Ni in the SLID and thermal aging processes at 220–260 °C and 100–150 °C, respectively, are investigated. The metallographic analysis indicates that the thin Au layer dissolves rapidly into the molten indium matrix, leaving only one IMC at the In/Ni interface in the SLID and aging reactions. Compositional and crystallographic analyses both confirm that the IMC is Ni 28 In 72 incorporated with a small amount of Au solubility. The thickness evolution of Ni 28 In 72 displays a linear relationship with the square root of reaction time, indicating a diffusion-controlled growth behavior.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied