Largely enhanced mechanical and dielectric properties of paper-based composites via in situ modification of polyimide fibers with SiO2 nanoparticles

Fan Xie,Nan Zhang,Zhaoqing Lu,Longhai Zhuo,Bin Yang,Shunxi Song,Panliang Qin,Ning Wei

DOI: https://doi.org/10.1007/s10971-018-4770-3

2018-08-09

Abstract:In this study, SiO2 nanoparticles were in situ grown onto the surfaces of polyimide fibers via sol–gel synthesis and the corresponding paper-based composites were fabricated by wet-forming process using the as-obtained fibers as the starting materials. A simultaneous enhancement of the tensile and tearing index as well as the interlayer bonding strength of paper-based composites could be achieved with an increment of 17.7%, 17.2% and 50%, respectively. What is more, the dielectric strength of the resultant composites increased by 127% compared with the pristine paper-based composites. The results indicated that the SiO2 nanoparticles could be used as an excellent interfacial linker between the fibers and polymer matrix, and a smart cushion to release interior and exterior applied forces. Besides, satisfactory results on thermal stability of paper-based composites were attained after coated with SiO2 nanoparticles.In this graphical abstract, carboxylated PI@SiO2 fibers were successfully fabricated via a facile approach that SiO2 nanoparticles were in-situ grown onto the surfaces of carboxylated PI fibers via sol-gel synthesis. Moreover, the modified paper-based composites consisting of carboxylated PI@SiO2 fibers possess more excellent dielectric strength compared with the pristine paper.

materials science, ceramics