Reduction of threading dislocation density and suppression of cracking in sputter-deposited AlN templates annealed at high temperatures

Kenjiro Uesugi,Yusuke Hayashi,Kanako Shojiki,Hideto Miyake
DOI: https://doi.org/10.7567/1882-0786/ab1ab8
IF: 2.819
2019-05-08
Applied Physics Express
Abstract:Abstract Combination of sputter deposition and high-temperature annealing is a promising technique for preparing AlN templates with a low threading dislocation density (TDD) at a lower film thickness compared to those prepared by the conventional metalorganic vapor phase epitaxy. However, cracking of AlN films during annealing is a critical issue. In this study, we controlled the residual stress of the sputter-deposited AlN films by modifying the sputtering conditions. Consequently, the occurrence of cracking was effectively suppressed. By optimizing the fabricating conditions, a TDD of 2.07 × 10 8 cm −2 was achieved for the AlN template with a thickness of 480 nm.
physics, applied
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