Abstract:Silica nanoparticles are widely utilized abrasives in chemical mechanical polishing (CMP), and the modification of abrasives and the incorporation of chemical additives represent primary strategies for enhancing CMP performance. In this study, we achieved a modification of the electrical properties of the colloidal silica surface by forming a coating film through the "grafting" of 3-aminopropyltriethoxysilane (APTES) onto the colloidal silica surface. This modification resulted in an augmented mechanical interaction between the abrasive and the wafer during the CMP process, leading to an enhanced material removal rate (MRR) of SiO 2 . However, the post-CMP surface exhibited a relatively higher occurrence of surface defects. Subsequently, cetyltrimethylammonium bromide (CTAB) was added as an auxiliary additive, which promoted the formation of a "special electrostatic self-assembly structure" on the surface of the abrasive, further elevating the SiO 2 MRR. Moreover, CTAB demonstrated the capability to adsorb onto the wafer surface, creating a protective effect that resulted in reduced surface roughness and a decrease in surface defects following CMP. Furthermore, comprehensive characterization of the modified abrasive was conducted using techniques such as transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The mechanisms underlying the improvement in CMP performance were systematically analyzed through experimental phenomena and X-ray photoelectron spectroscopy (XPS), and revealing that the introduction of CTAB indirectly facilitated the adsorption of APTES onto the surface of the colloidal silica. Our study provides a method for the advanced process of SiO 2 CMP with stringent metal ion requirements.

Preparation of three-dimensional dendritic-like mesoporous silica particles and their pore size-dependent polishing behavior and mechanism

A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance

Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon Substrates

Core–Shell Structured Silica Nanoparticles as Abrasive for Tungsten Chemical Mechanical Planarization

Polishing behavior of PS/SiO<sub>2</sub> Core-Shell nanoparticles with different shell thickness on fused silica Chemical Mechanical Polishing

Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)

Preparation of Silane Modified Sio2 Abrasive Particles and Their Chemical Mechanical Polishing (cmp) Performances

Development of core–shell SiO 2 @A-TiO 2 abrasives and novel photocatalytic chemical machinal polishing for atomic surface of fused silica

The Removal Mechanism of Monocrystalline Si in the Process of Double Diamond Abrasive Polishing by Molecular Dynamics Simulation

Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire

Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics

Characterization of colloidal silica abrasives with different sizes and their chemical–mechanical polishing performance on 4H-SiC (0 0 0 1)

Methods and Mechanistic Analysis of Improving the Dispersion of Nano Silica Colloidal Particles in Chemical Mechanical Polishing Slurries

Influence of Colloidal Silica Dispersion on the Decrease of Roughness in Silicon Chemical Mechanical Polishing

Investigation of the chemical action mechanism based on reactive force field in SiC chemical–mechanical polishing process

Reactive Molecular Dynamics Simulation of Si Chemical Mechanical Polishing Process

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Mechanical removal of SiC by multi-abrasive particles in fixed abrasive polishing using molecular dynamics simulation

Preparation of the rod-shaped SiO2@C abrasive and effects of its microstructure on the polishing of zirconia ceramics