Microstructure and Properties of Semi-solid Die Casting of High Silicon Aluminum Alloy with High Thermal Conductivity

Jin Liu,Shusen Wu,Jinqiao Zheng

DOI: https://doi.org/10.1007/978-981-32-9441-7_47

2019-08-31

Abstract:Electronic components, such as package substrate, need materials having high thermal conductivity and low expansion at the same time. The effect of semi-solid rheo-diecasting on microstructure, mechanical properties and thermal physical properties of high-silicon content aluminum alloy (Al-20Si-Cu-Fe-Mg) with high thermal conductivity and low thermal expansion, was investigated. The results show that compared with gravity casting, eutectic silicon in alloys made with semi-solid rheo-diecasting was refined, and the microstructure of the alloy was more homogeneous. There were few internal defects in castings and the tensile strength in as-cast cast state was increased to 192.4 MPa. At 25–150 °C range, the average thermal expansion coefficient was 17.05 × 10−6 ℃−1, which decreased by about 3.54%, and the average thermal conductivity was elevated to 146 W/(m · K), which increased about 17.5%.