Sputter film deposition to fabricate thick oxide films with extremely smooth surface suitable for room-temperature bonding

T. Saito,H. Makita,T. Moriwaki,Y. Suzuki,N. Kato,S. Wakayanagi,A. Miura,M. Uomoto,T. Shimatsu
DOI: https://doi.org/10.7567/1347-4065/ab4c85
IF: 1.5
2019-11-27
Japanese Journal of Applied Physics
Abstract:Energy-treatment sputtering (ETS), sputter film deposition performed during film growth with slightetching of the advancing surface with an ion-beam, can be applied to deposit SiO 2 films on glasswafers. The surface roughness S a of 700 nm thick ETS-SiO 2 film is 0.17 nm, which is remarkablylower than that of films deposited using conventional magnetron sputtering ( S a = 0.78 nm).Moreover, the S a of 700 nm thick ETS-SiO 2 film deposited on thick Al film having a rough surfaceof S a = 2.95 nm is only 0.24 nm. Bonding performance using ETS-SiO 2 films is identical to thatusing SiO 2 films with smooth surfaces obtained after chemical mechanical polishing.
physics, applied
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