Performance Evaluation of Si–Cu-Hybrid Dust as a Powder Additive of EDM Dielectrics to Machine Ti6Al4V with Copper Electrode

Shirsendu Das,Swarup Paul,Biswanath Doloi,Kumar Rahul Dey

DOI: https://doi.org/10.1007/978-981-32-9471-4_20

2019-11-23

Abstract:The wide utility of the EDM in industrial and biomedical sectors has drawn the attention of the researchers in the last few decades. In the meantime, intensive works have been performed to improve the machining performance of the EDM. Addition of powder additives in dielectric medium is one of those approaches which moderate the strength of the plasma channel by increasing the concentration of the ions. Powder dusts of copper, titanium, aluminum, tungsten, silicon/silica and carbon nanoparticles are some of the additives which have significant contributions on EDM process parameters. In this work the Si–Cu hybrid powder dust is added with kerosene oil and the comparative analysis is done based on the performance evaluations in terms of material removal rate (MRR) and surface roughness (SR). Silicon and copper are used individually earlier with other powder dust, but here both are added together with dielectric medium to evaluate their combined effects on surface characterizations. Because of the highly conductive nature of the copper, it increases the mobility of the ions and charge particles inside the ionization gap. On the other side, silicon is partially conductor and partially insulator in nature. So because of its semi-conductive properties, it can restrict the spark span and domain which possesses controlled machining. Therefore, the combined influence of these two powder additives gives some excellent features which are highlighted in this article.