The Conductivities of Electrically Conductive Adhesives Containing Silver-Coated Graphite Particles By Self-Activated Deposition

Shi-Chern Yen,Ti-Chiang Chueh,Chi-Hsien Hu

DOI: https://doi.org/10.1149/ma2013-02/3/205

2013-10-27

ECS Meeting Abstracts

Abstract:Abstract not Available.

What problem does this paper attempt to address?

Electroless Plating of Silver on Graphite Powders and the Study of Its Conductive Adhesive

Liang Tongxiang,Guo Wenli,Yan Yinghui,Tang Chunhe

DOI: https://doi.org/10.1016/j.ijadhadh.2007.03.006

IF: 3.848

2007-01-01

International Journal of Adhesion and Adhesives

Abstract:In this paper, silver plating graphite powders were developed by electroless plating method. The density of silver plating graphite powders was 2.61g/cm3 and the ratio of silver for the powders was 25wt%. After being mixed with epoxy resin and curing agent, silver plating graphite powders conductive adhesive was obtained, with the percolation concentration of 28vol%. Compared to pure Ag conductive adhesive, the new conductive adhesive has the advantage of low cost. Adhesives based on the graphite or Ag plating graphite powders exhibited higher tensile strength and larger failure elongations than pure Ag conductive adhesive.
Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Qing Hua Li,Jian Hua Zhang

DOI: https://doi.org/10.4028/www.scientific.net/KEM.353-358.2879

2007-01-01

Key Engineering Materials

Abstract:Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as the conducting filler. The effects of nano-fillers (SiO2 nano-particles and carbon nanotubes) on the conductivity, adhension strength and reliability of ICAs were investigated experimentally in this paper. The results showed that these two nano fillers can improve both the conductivity and adhesion strength of ICAs, which maybe attributed to the nano-particles forming physico-chemical bonds with epoxy resin. These physico-chemical bonds increase the contact area and then minish the interspace of Ag particles, so it reduces electrical resistance and enables a high current flow. And the increasing contact area will improve the contact strength between Ag particles and epoxy resin. Under the reliability testing with the high temperature and high humidity (85 degrees C/85RH), the SiO2 nano-particles can improve the reliability of ICAs apparently, while carbon nanotubes can not. This is because insulating material can prevent silver migration.
Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder

Z. Sahebi Hamrah,V.A. Lashgari,M.H. Doost Mohammadi,D. Uner,M. Pourabdoli

DOI: https://doi.org/10.1016/j.microrel.2021.114400

IF: 1.6

2021-12-01

Microelectronics Reliability

Abstract:Electrically conductive adhesives were made using silver-coated copper powders (filler) and epoxy. Resistivity, microstructure and shear strength of prepared adhesives were studied using two-point resistance measurements, Scanning Electron Microscope (SEM) and universal tensile tests, respectively. Effect of filler concentration (70–85 wt%), silver concentration (10–50 wt%), particles morphology (flake or spherical) and addition of graphite (2–15 wt%) were investigated on prepared adhesives properties. Results showed that by increasing the filler percentage from 70 to 85 wt%, the electrical resistivity decreases from 6.2 × 10−3 to 3 × 10−3 Ω·cm. Furthermore, the electrical resistivity of adhesives is proportional to the silver content of the filler particles. Regarding the morphological effect of filler particles, it was found that by replacing 40 wt% of the flake with spherical particles in the adhesive with a filler content of 75 wt%, the electrical resistivity of the adhesive reduces from 5.6 × 10−3 to 4.5 × 10−3 Ω·cm, while the electrical resistivity of the adhesive containing 50 wt% of the spherical particles reached to 1.1 × 10−2 Ω·cm. Graphite addition to adhesive formula in concentrations less than 6 wt%, slightly lowered the resistivity of the adhesives. Increasing the graphite addition from 6 to 15 wt% enhanced the electrical resistivity from 2.8 × 10−3 to 1.7 × 10−2 Ω·cm. The shear strength of the adhesives is inversely proportional to the filler percentage in the adhesives.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
In Situ Hydrothermal Synthesis of Silver Nanoparticle Based on Graphene and Their Application for Electrically Conductive Adhesive

Jinfeng Zeng,Hongru Ma,Xun Tian,Yanqing Ma

DOI: https://doi.org/10.1109/icept.2016.7583089

2016-01-01

Abstract:Electrically conductive adhesive based on epoxy and conductive materials, which have been considered as the new promising material for electronic packaging because of the advantages of low processing temperature, fine pitch interconnect and environmentally friendly. The silver nanoparticle based on graphene have been used in the electrically conductive adhesive as a result of the excellent electrical material. The number of effective conductive paths were improved after doping silver nanoparticle based on graphene into epoxy. So silver nanoparticle based on graphene was prepared in situ hydrothermal method via silver-ammonia solution and graphene oxide as initial solution without other supported reagents. Scanning Electron Microscopy, Transmission Electron Microscopy, X-ray diffraction and Raman spectroscopy were applied to analyze the morphologies and structures of silver nanoparticle based on graphene. Then electrically conductive adhesive was prepared by mixing silver nanoparticle based on graphene, silver flakes and epoxy together. The electrical properties of electrically conductive adhesive were tested by four-point probe method after cured at 150 °C for 2 h. The result shows that silver nanoparticles were dispersed on the surface of graphene layers uniformly and the average diameter of nanosilver particles is 80 nm. The electrical properties of electrically conductive adhesive was 7.0×10 -4 Ω·cm when the nanosilver based on graphene reached 0.2 %, which compared with electrically conductive adhesive (1.1×10 -3 Ω·cm) without nanosilver based on graphene was improved.
A Facile Ultra Sound-Assisted Fabrication Of Graphene Nanosheets-Silver Nanowires Hybrid Nanomaterial And Their Application To Electrically Conductive Adhesives

Hongru Ma,Jinfeng Zeng,Jingsi Song,Xiaopeng Chen,Yanqing Ma

DOI: https://doi.org/10.1109/CSTIC.2016.7463936

2016-01-01

Abstract:Electrically conductive adhesives (ECAs) is used to fix components in the process of chip bonding and surface in the assembly point glue, to form conductive or thermal connection as well as to improve reliability in the packing process of flip chip and Chip Scale Package (CSP), and even to protect components after the completion of assembly. ECAs with the excellent electrical conductivity performance are developed based on hybrid of graphene nanosheets-silver nanowires (GNs-AgNWs) and silver flakes. First, the contral sample only filled with silvers flakes is determined. Then, GNs-AgNWs hybrid nanomaterial was fabricated by a facile ultra sound-assisted method. The AgNWs with graphene have a synergistic effect in improving the electrical conductivity performance. As-prepared hybrid ECA with a low content of 0.5 % of GNs-AgNWs and 69.5 % of silver flakes are higher electrical conductivity performance than those of the control sample. Finally, the hybrid ECA with the optimal formulation will be a promising for application.
Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

Seyed Jamaleddin Peighambardoust,Hamed Rikhtegar,Parisa Mohammadzadeh Pakdel,Abdolreza Mirmohseni

DOI: https://doi.org/10.1002/pat.4632

IF: 3.348

2019-04-23

Polymers for Advanced Technologies

Abstract:In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver‐coated copper powder and silver‐coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fourier‐transform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver‐coated copper powder and 1% weight percentage silver‐coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10<sup>‐2</sup> Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive.

polymer science
Preparation and Properties of Conductive Epoxy Resin Composites

Xin Ding,Hue Wang,Xingyou Tian,Kang Zheng

DOI: https://doi.org/10.4028/www.scientific.net/amr.669.171

2013-01-01

Advanced Materials Research

Abstract:The conductive adhesives were prepared by using micron silver, ball-milled silver and the mixture of them as conductive fillers, respectively, and epoxy resin as matrix. In this study, The relationship between the resistivity with the content of silver fillers was tested. With the micron sliver loading from 60 wt% to 75 wt%, the resistivity decreases significantly about 8 orders of magnitude. And the effects of the different types of silver fillers (micron silver, ball-milled silver and the mixture of them) on the resistivity were also investigated. The study shows that the ECAs filled with the micron sliver gets the highest resistivity and the resistivity of ECAs which uses the ball-milled sliver as fillers is the lowest.
Binder Chemistry for Ultra-Highly Conductive Pastes by Low Temperature Sintering of Silver Micro-Fillers

M. Inoue,Yoshiaki Sakaniwa,Yasunori Tada

DOI: https://doi.org/10.1109/ECTC.2016.363

2016-05-01

Abstract:Effects of binder chemistry on the electrical conductivity of epoxy-based adhesives containing conventional silver micro-particles were investigated. Although no nano-sized fillers or organometallic precursors for nanoparticles were mixed into the adhesives, low temperature sintering of the micro-particles was successfully induced during curing at 200 °C when a bi-functional mercaptocarboxylate was used as the curing agent. The micro-particles could be also sintered with a silver substrate during curing. After curing, the adhesives exhibited ultra-high electrical and thermal conductivities.

Engineering,Materials Science,Chemistry
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Qiong Fan,Huiwang Cui,Chune Fu,Dongsheng Li,Xin Tang,Zhichao Yuan,Lilei Ye,Johan Liu

DOI: https://doi.org/10.1149/1.3567678

2011-03-21

ECS Transactions

Abstract:This research used low molecular surface modifiers, and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Several different functionalizers, such as thioglycolic acid, silane and di-acid, were used to functionalize the silver surface. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. The adipic acid had the greatest effect on the rheological and electrical property of ICAs, so its weight percentage in silver flakes was also optimized; ICAs displayed the maximum electrical conductivity when there was 0.5 wt% of silver flakes.
The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Z. X. Zhang,X. Y. Chen,F. Xiao

DOI: https://doi.org/10.1163/016942410x549924

IF: 2.431

2011-01-01

Journal of Adhesion Science and Technology

Abstract:Electrically conductive adhesives (ECAs) filled with sintered silver nanowires were prepared and the effect of different curing conditions on the electrical property of the ECAs was discussed. Silver nanowires with a diameter of 50-60 nm and a length of 2-3 mu m were successfully synthesized through a polyol process and surface functionalized with dicarboxylic acid. Morphology studies showed that surface modified silver nanowires began to sinter at 200 degrees C and became shorter and thicker, and eventually formed large chunks at higher temperatures. The conductive adhesives filled with 75 wt% of silver flakes and nanowires (3:2 weight ratio) were cured at different temperatures using two kinds of catalysts. The volume resistivity of the conductive adhesives cured at 300 degrees C without a catalyst reached 5.8 x 10(-6) Omega cm. The dramatic improvement in the conductivity of the ECA is due to the sintering of silver nanowires and the high solid content resulting from the partial evaporation of polymer components. (C) Koninklijke Brill NV, Leiden, 2011
Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Xiaomin Zhang

DOI: https://doi.org/10.1016/j.microrel.2023.114917

IF: 1.6

2023-02-01

Microelectronics Reliability

Abstract:Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has a broad application prospect in electronic devices. In order to explore the preparation method of high-purity nanometal conductive filler for conductive adhesive, silver nanopowders were prepared by DC arc plasma method. The silver nanopowders present a spherical structure and the average particle size is 55 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 °C for 10 min. The electrical and mechanical properties of above ECA were investigated and characterized. The ECA filled with 75 % silver nanopowders exhibits excellent performances, including high electrical conductivity (9.8 × 10 −3 Ω·cm) and high bonding strength (8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Weiwei Zhang,Jintao Wang,Hao Liu,Zheng Zhang,Jianqiang Wang,Luobin Zhang,Haozhong Wang,Fengyi Wang,Fangcheng Duan,Jiahao Liu,Mingyu Li,Chunjin Hang,Hongtao Chen

DOI: https://doi.org/10.1016/j.ijadhadh.2022.103300

IF: 3.848

2022-01-01

International Journal of Adhesion and Adhesives

Abstract:Coupling agents are widely used in order to improve the properties of electrically conductive adhesives (ECAs). The effects of different coupling agents on the characteristics of epoxy-based ECAs were investigated in terms of thermal, rheological, electrical and mechanical properties. Results showed that the ECAs had favourable flow, adhesion and good conductivity. In particular, the ECAs filled with Ag flakes treated with the silane coupling agent 3-aminpropyltriethoxysilane (KH-550) exhibited the lowest electrical resistivity (5.22 x 10-4 omega cm) and the highest shear strength (20.32 MPa) among the ECAs. Besides, it had the minimum viscosity 154 Pa s at 5 rpm/25 degrees C. It was also found that the adding of coupling agents had different effects on the aging electrical and shear strength of the ECAs. According to this study, the use of KH-550 had a significant electrical conductivity improvement and shear strength increase before and after aging. In addition, a strong adhesion/bonding between the conductive fillers and the resin matrix was revealed by scanning electron microscopy studies.
Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Na Cheng,Zhi Sun,Xiaohui Yu,Qianzhen Yu,Jianwei Zhao

DOI: https://doi.org/10.1039/d3cp00209h

IF: 3.3

2023-01-01

Physical Chemistry Chemical Physics

Abstract:To impart conductivity and improve the shear performance of epoxy resin-based adhesives, a simple, environmentally friendly, and stable method was used to deposit silver on the surface of 5 μm flake copper particles as a conductive filler. The core-shell metal fillers were prepared by utilizing the autocatalytic properties of Cu without adding any reducing agent during the reaction. An epoxy curing agent (MeTHPA) was used as a curing agent for the crosslinking reaction with epoxy resin to form a supporting skeleton of conductive components. The structure of flake plated Cu@Ag particles was characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive spectroscopy (EDS). It was verified that a layer of compact and crystalline silver with a concave-convex characteristic was deposited on the surface of copper particles. This feature has a positive effect on improving the performance of silver-plated copper particles. The results show that the optimal curing condition of flake plated Cu@Ag particle-epoxy composite electrically conductive adhesives (ECAs) was 200 °C for 1 h, the resistivity of flake plated Cu@Ag particle-epoxy composite ECAs with a content of flake plated Cu@Ag particles above 55 wt% was less than 6 × 10-5 Ω m, and the maximum shear strength was 8 MPa. The flake plated Cu@Ag particle-epoxy composite ECAs prepared by this method have excellent properties and have very important application value for advanced electronic devices.
Preparation and characterization of Ag conductive adhesive with low resistivity

Xiwen Chen,Xiang Niu,Junying Lai,Jiaxing Tang,Zhiyi Xu,Jiye Luo,Yingbang Yao

DOI: https://doi.org/10.1007/s10854-024-13621-1

2024-10-05

Journal of Materials Science Materials in Electronics

Abstract:We used bisphenol-F epoxy resin as an insulating polymer matrix, micron silver flakes and silver nanoparticles as conductive fillers, and dimethylformamide (DMF) as an organic solvent to obtain a Ag conductive adhesive with low resistivity. The silver content, organic solvent, and the ratio of micron silver to nano-silver were thoroughly investigated and optimized. Ultimately, it was determined that the optimal formulation for the conductive adhesive consisted of 86 wt silver with 40:1 micron silver to nano-silver, 10.24 wt epoxy resin, and 3.76 wt DMF. Tests for resistivity and shear strength were conducted on the optimal formulation. A resistivity as low as 8 μΩ cm was obtained. The shear strength can reach to ~ 87 MPa. The reduction in resistivity of the conductive adhesive is attributed to the ability of the formulation to allow micron and nano-silver to be tightly linked in the conductive adhesive to form a good conductive network and promote electron tunneling effect. The current silver conductive adhesive shows promise in microelectronic packaging industries.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Hongru Ma,Zhuo Li,Xun Tian,Shaocun Yan,Zhe Li,Xuhong Guo,Yanqing Ma,Lei Ma

DOI: https://doi.org/10.1007/s11664-018-6145-5

IF: 2.1

2018-01-01

Journal of Electronic Materials

Abstract:Silver dendrites were prepared by a facile replacement reaction between silver nitrate and zinc microparticles of 20 μm in size. The influence of reactant molar ratio, reaction solution volume, silver nitrate concentration, and reaction time on the morphology of dendrites was investigated systematically. It was found that uniform tree-like silver structures are synthesized under the optimal conditions. Their structure can be described as a trunk, symmetrical branches, and leaves, which length scales of 5–10, 1–2 μm, and 100–300 nm, respectively. All features were systematically characterized by scanning electron microscopy, transmission electron microscopy (TEM), high-resolution TEM, and x-ray powder diffraction. A hybrid fillers system using silver flakes and dendrites as electrically conductive adhesives (ECAs) exhibited excellent overall performance. This good conductivity can be attributed mainly to the synergy between the silver microflakes (5–20 μm sized irregular sheet structures) and dendrites, allowing more conductive pathways to be formed between the fillers. In order to further optimize the overall electrical conductivity, various mixtures of silver microflakes and silver dendrites were tested in ECAs, with results indicating that the highest conductivity was shown when the amounts of silver microflakes, silver dendrites and the polymer matrix were 69.4 wt.% (20.82 vol.%), 0.6 wt.% (0.18 vol.%), and 30.0 wt.% (79.00 vol.%), respectively. The corresponding mass ratio of silver flakes to silver dendrites was 347:3. The resistivity of ECAs reached as low as 1.7 × 10−4 Ω cm.
Recent Progress in Conductive Adhesives

苏辉煌,钟新辉,詹国柱,余英丰

DOI: https://doi.org/10.3969/j.issn.1001-5922.2008.06.008

2008-01-01

Abstract:The mechanisms of conductivity of conductive adhesives were introduced,and possible methods for property improvement were also analyzed in this article.And it also gives a brief review of the influences of processes on conductivity,contact resistance stability and mechanical properties of isotropically conductive adhesives.
Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Tao Xu,Jiayu Chen,Wenhui Yuan,Yinhua Liu,Yongjun Sun,Huijun Wu,Xiaoqing Zhou

DOI: https://doi.org/10.3390/ma11102028

IF: 3.4

2018-01-01

Materials

Abstract:Among recent advances in electronic packaging technologies, electrically conductive adhesives (ECAs) attract most researchers’ attention, as they are environment-friendly and simple to apply. ECAs also have a lower operating temperature and volume resistivity compared with conventional electronic conductive adhesives. In ECAs, the conducting fillers play a significant role in improving conductivity and strength. In this work, as filler additives, the silver nanowires/graphene nanocomposites (AgNWs-GNs) were successfully fabricated via a facile self-assembly method. The characteristics of the as-prepared nanocomposites were evaluated by FTIR (Fourier Transform infrared spectroscopy), XRD (X-ray Diffraction), XPS (X-ray photoelectron spectroscopy), TEM (Transmission electron microscope) and Raman tests, demonstrating a successful synthesis process. Different amounts of AgNWs-GNs were used as additives in micron flake silver filler, and the effects of AgNWs-GNs on the properties of ECAs were studied. The results suggested that the as-synthesized composites can significantly improve the electrical conductivity and shear strength of ECAs. With 0.8% AgNWs/GNs (AgNWs to GO (Graphite oxide) mass ratio is 4:1), the ECAs have the lowest volume resistivity of 9.31 × 10−5 Ω·cm (95.4% lower than the blank sample without fillers), while with 0.6% AgNWs/GNs (AgNWs to GO mass ratio is 6:1), the ECAs reach the highest shear strength of 14.3 MPa (68.2% higher than the blank sample).
The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Fei Xiao

2010-01-01

Abstract:Silver flakes are widely used as electrically conductive adhesive(ECA) fillers due to the good formation of conductive channels through the line contacts or surface contacts between flakes.The different surface treatments of silver flake for ECA can affect the conductive property and the bonding strength of ECA and the results showed that the dicarboxylic acids can increase the conductivity of ECA significantly.When the surface of silver flakes were modified by pentanedioic acid,the resistivity and the bonding strength of the ECA in a filler loading of 80% can reach 4.0×10-5 Ω·cm and 4.2×106Pa,respectively.About 1.4% pentanedioic acid was adsorbed on silver surface by chemiadsorption.
Synthesis and Properties of Hyperbranched Poly (Amine-Ester) Modified Polysiloxane/Nano-silver Conductive Adhesives

Meng-qin Xia,Kong-hua Liu,Shi-long Chen,Yu-qing Gao,Yuan-fang Luo,Lan Liu

DOI: https://doi.org/10.3724/sp.j.1105.2014.13331

2014-01-01

Abstract:This paper presents an approach to prepare polysiloxane-based conductive composites filled with low-cost silver coated copper (Ag-coated Cu) microscale flakes by using the hyperbranched poly(amine-ester) (HBP3,-MA) as modifier which is obtained by the reaction between the hyperbranched poly (amine-ester) (HBP3-OH) with terminal hydroxyl and maleic anhydride. The structure of the HBP3-MA was characterized by Fourier transform infrared (FTIR) and nuclear magnetic resonance (NMR). Curing condition of the compound system was studied by differential scanning calorimetry (DSC) since HBP3-MA was involved in the curing reaction of polysiloxane. The structural morphology (the size and dispersion) of in situ reduced AgNPs and the composite system was studied by transmission electron microscopy (TEM) and scanning electron microscopy (SEM). Also, conductivity mechanism of the composites reinforced by metal nanoparticles was discussed. At the curing temperature, silver acetate decomposed and silver nanoparticles (AgNPs) were in situ generated in the polymer matrix. The low temperature sintering of AgNPs anchored on the surface of Ag-coated Cu flakes enhanced the interfacial bond of Ag-coated Cu flakes and decreased the overall contact resistance. Last, the conductivity and shear strength of the composites were studied. When the content of silver acetate was 4.4 phr the optimum volume resistivity and the shear strength were achieved, which were 3.6 x 10(-30) Omega.cm and 0.32 MPa, respectively.
Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Ya Chen,Qiulong Li,Chaowei Li,Zhengfei Dai,Han Yan,Meng Zhu,Yongyi Zhang,Yagang Yao,Qingwen Li

DOI: https://doi.org/10.1016/j.compositesa.2020.106025

2020-01-01

Abstract:Electrically conductive adhesives (ECAs) are widely used in electronics and silver-based ECA is one of the most typical representatives. In this work, a trinary silver-based filler strategy was proposed to achieve ECAs with high conductivity and low silver content, where silver fractal flowers (Ag-FWs) were used to set up the conductive framework and silver nanowires (Ag-NWs) and silver nanoflakes (Ag-NFs) were added to connect the separated domains and fill the small gaps, respectively. The ECAs reached a low electrical resistivity of 6.0 x 10(-5) Omega cm and high adhesion strength of 13.5 MPa when the addition of Ag-FWs, Ag-NWs and Ag-NFs were 50 wt%, 7.5 wt % and 2.5 wt%, respectively, superior to those reported ECAs of 80 wt% silver loading. Besides, the ECA circuit fabricated by 3D printer demonstrated good electrical conductivity and resistance stability. The preparation idea of ECAs brings novel opportunities for the development of the electronic packaging industries.

The Conductivities of Electrically Conductive Adhesives Containing Silver-Coated Graphite Particles By Self-Activated Deposition

Electroless Plating of Silver on Graphite Powders and the Study of Its Conductive Adhesive

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder

In Situ Hydrothermal Synthesis of Silver Nanoparticle Based on Graphene and Their Application for Electrically Conductive Adhesive

A Facile Ultra Sound-Assisted Fabrication Of Graphene Nanosheets-Silver Nanowires Hybrid Nanomaterial And Their Application To Electrically Conductive Adhesives

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

Preparation and Properties of Conductive Epoxy Resin Composites

Binder Chemistry for Ultra-Highly Conductive Pastes by Low Temperature Sintering of Silver Micro-Fillers

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Preparation and characterization of Ag conductive adhesive with low resistivity

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Recent Progress in Conductive Adhesives

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Synthesis and Properties of Hyperbranched Poly (Amine-Ester) Modified Polysiloxane/Nano-silver Conductive Adhesives

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives