Mixed-size diamond seeding for low-thermal-barrier growth of CVD diamond onto GaN and AlN

E.J.W. Smith,A.H. Piracha,D. Field,J.W. Pomeroy,G.R. Mackenzie,Z. Abdallah,F.C.-P. Massabuau,A.M. Hinz,D.J. Wallis,R.A. Oliver,M. Kuball,P.W. May
DOI: https://doi.org/10.1016/j.carbon.2020.05.050
IF: 10.9
2020-10-01
Carbon
Abstract:<p>We report a method of growing a diamond layer <em>via</em> chemical vapour deposition (CVD) utilizing a mixture of microdiamond and nanodiamond seeding to give a low effective thermal boundary resistance (TBR<sub>eff</sub>) for heat-spreading applications in high-frequency, high-power electronic devices. CVD diamond was deposited onto thin layers of both GaN and AlN on Si substrates, comparing conventional nanodiamond seeding with a two-step process involving sequential seeding with microdiamond then nanodiamond. Thermal properties were determined using transient thermoreflectance (TTR), and the samples were also analysed with SEM and X-ray tomography. While diamond growth directly onto GaN proved to be unsuccessful due to poor adhesion, films grown on AlN were adherent and robust. The two-step mixed-seeding method gave TBR<sub>eff</sub> values &lt; 6 m<sup>2</sup> K GW<sup>−1</sup> that were 30 times smaller than for films grown under identical conditions but using nanodiamond seeding alone. Such remarkably low thermal barriers obtained with the mixed-seeding process offer a promising route for fabrication of high-power GaN HEMTs using diamond as a heat spreader with an AlN interlayer.</p>
materials science, multidisciplinary,chemistry, physical
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