Characterization of Gan/Sapphire Interface and the Buffer Layer by TEM/AFM

B. Shea,Q. Sun-Paduano,D. F. Bliss,M. C. Callahan,C. Sung
DOI: https://doi.org/10.1017/s1431927600027720
IF: 4.0991
2001-08-01
Microscopy and Microanalysis
Abstract:Interest in wide band gap III-V nitride semiconductor devices is increasing for optoelectronic and microelectronic device applications. to ensure the highest quality, TEM analysis can characterize the substrate and buffer layer interface. Measurements taken by TEM reveal the density of dislocations/cm 2 and the orientation of Burger's vectors. This information allows for changes to be made in deposition rates, temperatures, gas flow rates, and other parameters during the processing. The GaN/sapphire samples grown at AFRL were produced in two consecutive steps, first to provide a thin buffer layer, and the other to grow a lum thick epitaxial film. Both growth steps were prepared using metallic organic chemical vapor deposition (MOCVD) in a vertical reactor. Buffer layers were prepared using a range of temperatures from 525 to 535°C and with a range of flow rates and pressures in order to optimize the nucleation conditions for the epitaxial films.
materials science, multidisciplinary,microscopy
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