Abstract:The 5G products and service with widened band and high frequency including mm wave have been commercially started. General dielectric materials like polyimides or epoxy resins have large transmission loss in high frequency region. The loss is divided into mainly two factors, dielectric loss and conductor loss. In order to reduce the transmission loss, dielectrics need to have lower dissipation factor and conductor such as copper foil needs to have lower surface roughness. Thus, we simulate the impact of dielectric loss by dissipation factor and conductor loss by surface roughness on transmission loss. Furthermore, we experimentally confirmed the accuracy of the simulation by the transmission measurement with various core films. The simulation revealed that applying lower dissipation factor of core film is the most effective method to reduce the transmission loss. Simulation and experiment of transmission loss trend are well matched with multi-layer dielectrics. From such knowledge, we have developed new dielectric materials with low dissipation factor along with strong adhesion to copper foil with smooth surface. Adhesive usually needs to have polar chemical structure for better adhesion yet the polarity tends to increase dielectric constant and loss tangent. Therefore, satisfy adhesion and low dielectric constants at the same time was difficult. Recent work at JSR discovered a chemical structure that keep dielectric constants low while exhibit polarity, which enhances adhesion. This new material can be used as an adhesive between polyimide and copper foil with smooth surface. Flexible printed circuit was fabricated using our new adhesive along with the conventional polyimide film and copper foil with smooth surface. Measurement of transmission line of the circuit revealed significant improvement of transmission loss at mm wavelength range. We hereby report the details of the simulation and measurement results of the novel dielectric adhesive with low loss tangent.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is that in 5G communication products and services, existing dielectric materials such as polyimide or epoxy resin have a large transmission loss problem in the high - frequency region. Specifically, the transmission loss is mainly divided into two factors: dielectric loss and conductor loss. In order to reduce the transmission loss, the dielectric material needs to have a low dissipation factor, and conductors such as copper foil need to have a low surface roughness. Therefore, the author verified the effectiveness of the low dissipation factor in reducing the transmission loss through simulation and experiment, and developed a new dielectric material. This material not only has a low dissipation factor, but also can maintain good adhesion with the copper foil with a smooth surface. The key issues mentioned in the paper include: 1. **Transmission loss at high frequencies**: With the development of 5G technology, the application of high - frequency bands (including millimeter waves) is becoming more and more widespread, but the existing dielectric materials have large transmission losses in these frequency bands, which affects the signal transmission efficiency. 2. **Dielectric loss and conductor loss**: The transmission loss is mainly composed of dielectric loss and conductor loss. Among them, the dielectric loss is related to the dissipation factor of the material, and the conductor loss is related to the roughness of the conductor surface. 3. **Challenges in material design**: Developing a dielectric material with low dielectric constant (Dk), low dissipation factor (Df) and good adhesion at the same time is a challenge, because usually increasing the polarity of the material can improve the adhesion, but it will increase the dielectric constant and dissipation factor. In order to solve these problems, the author carried out the following work: - **Simulation study**: By simulating the influence of materials with different dielectric constants and dissipation factors and copper foils with different surface roughness on the transmission loss, it was determined that reducing the dissipation factor is the most effective method to reduce the transmission loss. - **Experimental verification**: The transmission characteristics of different core films were measured by experiments to verify the accuracy of the simulation results. - **New material development**: A new dielectric material (HC - F) was developed. This material has a low dissipation factor, good thermal stability and good adhesion with the copper foil with a smooth surface. In short, this paper aims to develop a low - transmission - loss dielectric material suitable for 5G communication through material design and optimization, so as to improve the transmission efficiency and reliability of high - frequency signals.

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