Reversible Adhesive Film with Ultralow Dielectric Loss in High Frequency via Surface Anchoring of Catechol

Jiading Wang,Ruikun Wang,Shengqiang Nie,Shaoyun Guo,Xianlong Zhang
DOI: https://doi.org/10.1021/acsami.4c12258
IF: 9.5
2024-09-29
ACS Applied Materials & Interfaces
Abstract:Debonding of the dielectric adhesive material will make the high-frequency communication equipment unusable, leading to resource wasting and electronic waste. Reversible adhesive is an ideal strategy to realize the reuse of debonding devices, but the low dielectric loss requirement of the dielectric adhesive materials in high-frequency devices limits its development. Here, the surface anchoring design of catechol was proposed to prepare a reversible adhesive film with ultralow dielectric loss in...
materials science, multidisciplinary,nanoscience & nanotechnology
What problem does this paper attempt to address?