Low Density Syntactic Foam Composites as Ablative TPS Material for High Heat Flux Conditions for Reentry Missions

M. Satheesh Chandran,K. Sunitha,N. Uday Bhaskar,K. S. Santhosh Kumar,N. Sreenivas,Dona Mathew
DOI: https://doi.org/10.1007/s41403-021-00217-y
2021-03-01
Abstract:Low density ablative syntactic foam composites based on chopped fiber reinforcement and glass microballoon dispersed in high char-yielding thermoset resin viz, Resole Phenolic Resin (RPR) were investigated as potential thermal protection system for Crew module forward heat shield TPS at high heat flux conditions corresponding orbital re-entry conditions. The composites were prepared by impregnating two type of fibers (Silica and Carbon fiber) with RPR and subsequent curing through compression molding technique. The density of the composites varied from a minimum of 0.48 g/cc to a maximum of 1.1 g/cc achieved by varying the proportions of the individual components. All the varieties of composites showed good mechanical properties (Compressive strength 20–60 MPa) and low thermal conductivity (0.2–0.35 W/mK). Aerothermal properties were evaluated through Kinetic Heat Simulation (KHS) and the tests were carried out for a duration of 1200 s, though the heating history ends at 463 s. Surface degradation was observed in all cases which is progressively improved with increasing density in the case of silica fiber-reinforced composites, whereas the surface degradation pattern was found minimal for the carbon fiber reinforced counterparts. Varying the length of the reinforcement was found to be effective in retaining the integrity of the rest of the bulk material after KHS test. Studies by plasma arc jet test at a heat flux of 120–130 W/cm2 for a duration of 20 s resulted in a heat of ablation of 23–25 MJ/kg for the composites. The studies show that ablative systems based on these syntactic foams can be a better candidate as TPS with good mechanical properties and thermal performance with reduced density.
What problem does this paper attempt to address?