Electrostatically doped ballistic transition metal dichalcogenide tunnel field-effect transistors
DOI: https://doi.org/10.1007/s10854-024-12626-0
2024-04-27
Journal of Materials Science Materials in Electronics
Abstract:Designed in a sub-11nm channel double-gate structure is the transition-metal dichalcogenide (TMD) tunnel field-effect transistors (TFETs), electrostatically doped by two top and bottom side gates. The self-consistent solution of the Poisson and Schrödinger equations within the non-equilibrium Green's function (NEGF) formalism is to carry out the numerical simulations for studying the transfer ( I D – V GS ) and output ( I D – V DS ) characteristics of TFETs. Moreover, device parameters are extracted from I D – V GS , charge density, potential profile, and transmission probability. The results are then investigated for various source/drain doping levels, manifesting the versatile TFETs, utilizing only two supply voltages, for diverse functionalities, from low power to high performance. In an analysis of two nominated molybdenum disulfide (MoS 2 ) and tungsten ditelluride (WTe 2 ) TFETs, I ON / I OFF (on to off-current ratio) = 1.9 × 10 15 and SS (subthreshold swing) = 9 mV/dec is calculated for the prior versus g m (transconductance) and D i (intrinsic delay) of about 4 × 10 3 μS/μm and 0.1 ps, respectively, for the latter. Considering a shrunk channel down to 3nm, the device switches remarkably fast with ultra-low power dissipation despite the increased leakage current (diminished I ON / I OFF ratio) and subthreshold swing. Additionally, robust functionality is observed for the TFETs operating under 500 K temperature fluctuations.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied