Abstract:In the semiconductor industry supply chain, there are complex processing steps from wafer to chip. Rapid Thermal Processing (RTP) is one of the key technologies, using lasers or high-temperature lamps to rapidly heat the wafer to over 1000°C for several seconds. This technique can produce high-quality silicides and oxides on the wafer while reducing the thermal budget in terms of temperature and time. RTP systems must be able to change the spatial energy distribution radiated onto the wafer to maintain temperature uniformity under different processing conditions, including varying gases, pressures, and wafer structures. However, the non-equilibrium conditions in RTP make modeling and prediction challenging, with temperature coupling issues in different wafer regions. This paper models the wafer heating system as a 5th-order time-delayed first-order inertia matrix and proposes a corresponding feedforward decoupling method. Traditional incremental PID control, when ramping up temperatures above 1000°C, leads to prolonged oscillations near the target temperature due to temperature coupling between regions, resulting in slow temperature convergence. The method proposed in this paper can effectively eliminate inter-regional coupling effects, unify PID parameters for better determination, and deploy them in practical RTP systems. Experimental results demonstrate that temperature convergence can be achieved rapidly, enhancing system heating efficiency. This study provides an effective solution to temperature control issues in wafer processing, with important practical implications for the semiconductor equipment manufacturing industry.

Optimization of rapid thermal processing for uniform temperature distribution on wafer surface

A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing

A MIMO Decoupling Algorithm for Rapid Heating Systems of Wafers

Modelling of wafer heating during rapid thermal processing

Improvement of temperature homogeneity of a silicon wafer heated in a rapid thermal system (RTP: Rapid Thermal Process) by a filtering window

Analysis of the Effect of Heating Control Conditions on Temperature Distribution in a Wafer During Rapid Thermal Processing With Lamp Heaters

Analysis of thermal spreading resistance in high power LED package and its design optimization

Rapid thermal processing with microwave heating

Decentralized control of wafer temperature for multizone rapid thermal processing systems

Modeling Of Two-Dimensional Dynamic Temperature Distribution Of A Lpcvd Process And Control Design By Mpc

Effect of Rapid Thermal Processing on High Temperature Oxygen Precipitation Behaviour in Czochralski Silicon Wafer

Effects of Rapid Thermal Processing on Oxygen Precipitation in Czochralski Silicon Wafer

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Design of Single-Wafer Furnace and Its Rapid Thermal Processing Applications

Observer-based temperature control of an LED heated silicon wafer

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Temperature Uniformity Control in MOCVD Based on Modeling and Optimization

Heat Transfer Analysis and Optimization for Wafer System of Laser Annealing Equipment

Experimental application of a quadratic optimal iterative learning control method for control of wafer temperature uniformity in rapid thermal processing

An efficient photon utilization radioisotope thermophotovoltaic based on curled reflectors

Effect of Rapid Thermal Processing on Oxygen Precipitation in Czochralski Silicon Subjected to Simulating CMOS Thermal Processing