Decentralized control of wafer temperature for multizone rapid thermal processing systems

C.D. Schaper,T. Kailath,Yong Jin Lee
DOI: https://doi.org/10.1109/66.762877
IF: 2.7
1999-05-01
IEEE Transactions on Semiconductor Manufacturing
Abstract:Decentralized control is shown through analysis and experimentation to be an appropriate strategy for wafer temperature control in certain multizone rapid thermal processing (RTP) systems. An input-output controllability analysis is conducted to illustrate that the direction associated with the reference command (set-point) corresponding to a spatially uniform temperature trajectory specification is nearly in alignment with the "most" controllable direction associated with the maximum singular value for a multiple concentric lamp configuration. Consequently, the control structure need not alter the directionality of the plant and, thus, can be achieved by a simple decentralized controller where the lamps are paired individually to sensors to achieve a multiloop structure where all interactions are not taken explicitly into account. This result is shown to produce acceptable performance even for an ill-conditioned plant since the directions corresponding to the smaller singular values are irrelevant to the uniform temperature control criteria. Moreover, straightforward nonmodel-based tuning of the controller is enabled due to the simplicity of the decentralized control structure.
engineering, manufacturing, electrical & electronic,physics, condensed matter, applied
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