Temperature Dependence on Dry Etching of Hafnium Oxide Using an Inductively Coupled Plasma

Young-Hee Joo,Jong-Chang Woo,Xue Yang,Chang-Il Kim
DOI: https://doi.org/10.1080/00150193.2010.484648
2010-10-29
Ferroelectrics
Abstract:We investigated the dependence of the etch rate of HfO2 thin films and selectivity of HfO2 over SiO2 in inductively coupled plasma on the substrate temperature in the range from 10°C to 80°C. The additional etch parameters examined were the amount of Cl2 added to BCl3/Ar (at a fixed gas mixing ratio of 4 sccm/16 sccm), RF power, DC-bias voltage and process pressure. The maximum etch rate of 125 nm/min was obtained at Cl2/BCl3/Ar = 2 sccm/4 sccm/16 sccm, an RF power of 600 W, DC-bias voltage of −200 V, process pressure of 15 mTorr and substrate temperature of 80°C. The selectivity of HfO2 over SiO2 was 0.79. The analysis by X-ray photoelectron spectroscopy explained the etching mechanism based on the physical and chemical pathways in the ion-assisted physical reaction.
materials science, multidisciplinary,physics, condensed matter
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