Abstract:Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SHM describes the process of using a systematic approach to identify damage in engineering infrastructure. A method of SHM that uses piezoelectric wafers connected directly to the structure has become increasingly popular. An investigation of a novel pitch-catch method of determining instrumentation quality of piezoelectric wafer active sensors (PWASs) used in SHM was conducted as well as an investigation into the effects of defects in piezoelectric sensors and sensor bonding on the sensor response. This pitch-catch method was able to verify defect-less instrumentation quality of pristinely bonded PWASs. Additionally, the pitch-catch method was compared with the electromechanical impedance method in determining defects in piezoelectric sensor instrumentation. Using the pitch-catch method, it was found that defective instrumentation resulted in decreasing amplitude of received and transmitted signals as well as changes in the frequency spectrums of the signals, such as the elimination of high frequency peaks in those with defects in the bonding layer and an increased amplitude of around 600 kHz for a broken PWAS. The electromechanical impedance method concluded that bonding layer defects increase the primary frequency peak's amplitude and cause a downward frequency shift in both the primary and secondary frequency peaks in the impedance spectrum, while a broken sensor has the primary peak amplitude reduced while shifting upward and nearly eliminating the secondary peak.

Automatic performance testing of piezoelectric ceramics for power transducers

Development of a High-Power Testing System for Piezoelectric Ceramic Material

Analysis of High Power Behavior in Piezoelectric Ceramics from a Mechanical Energy Density Perspective

Defect Engineering in Lead Zirconate Titanate Ferroelectric Ceramic for Enhanced Electromechanical Transducer Efficiency

Electrical Characteristics of High-Performance Ultrasonic Transducer for Non-Destructive Testing

Origin of Reliable High-Power Performances of PbZr 0.5 Ti 0.5 O 3 -Pb(Mn 1/3 Nb 2/3 )O 3 -Based Piezoelectric Ceramics

Origin of Reliable High-Power Performances of PbZr0.5Ti0.5O3-Pb(Mn1/3Nb2/3)O3-Based Piezoelectric Ceramics.

Feasibility Study for Monitoring an Ultrasonic System Using Structurally Integrated Piezoceramics

High Power Characterization of Piezoelectric Ceramics Using the Burst/Transient Method with Resonance and Antiresonance Analysis

Porosity-Graded Piezoelectric Ceramics: Processing and Electric-Induced Displacement

Vibration and Temperature Measuring Experiments on Multilayer Piezoelectric Actuator

Characterization of Full Set Material Constants and Their Temperature Dependence for Piezoelectric Materials Using Resonant Ultrasound Spectroscopy

Fabrication and Evaluation of Porous Piezoelectric Ceramics and Porosity–Graded Piezoelectric Actuators

Properties of piezoceramic materials in high electric field actuator applications

Characterization of Piezoelectric Materials Using Ultrasonic and Resonant Techniques

Analysis of Lead-Free Piezoceramic-Based Power Ultrasonic Transducers for Wire Bonding

High-Performance Piezoelectric Characteristics of Sm Substituted Pb(Ni,Nb)O3-Pb(Zr,Ti)O3-Pb(Mg,W)O3 System Ceramics for Ultrasonic Transducer Application

High-field dielectric properties and high-power performance of Fe-modified PZN–PMS–PZT piezoelectric ceramics

Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications

Enhancing the piezoelectric properties and thermal stability of PMN-PMS-PSZT high-power piezoelectric ceramics through defect engineering

Extremely large strain response under low driving electric fields in lead-based textured piezoelectric ceramics