Thermal and Electrical Conductivity of Copper‐Graphene Heterosystem: An Effect of Strain and Thickness
Aiswarya Samal,Anoop Kumar Kushwaha,Debashish Das,Mihir Ranjan Sahoo,Nicholas A. Lanzillo,Saroj Kumar Nayak
DOI: https://doi.org/10.1002/adem.202201192
IF: 3.6
2023-03-31
Advanced Engineering Materials
Abstract:Copper‐graphene (Cu/Gr) composite carries high thermal (κ) and electrical (σ) conductivities compared to pristine copper film/surface. For further improvement, we have applied strain (compressive and tensile) and changed the thickness (of both copper and graphene). We observed that electronic thermal conductivity (κ e ) and σ enhanced from 320.72 W/mK to 869.765 W/mK and 5.28×107 S/m to 23.01×107 S/m, respectively, by applying 0.20% compressive strain. Increasing copper‐thickness (three‐ to seven‐layers) in Cu(111)/single‐layer‐graphene (SLG) heterosystem, κ e increases from 320.72 W/mK to 571.81 W/mK. while electrical resistivity (ρ∝(1/σ)) decreases from 0.189×10‐7 Ωm to 0.117×10‐7 Ωm. Furthermore, increasing graphene‐thickness (one‐ to four‐layers) in seven‐layer‐Cu(111)/multi‐layer‐graphene (MLG) heterosystem, κ e enhances upto 126% while ρ decreases upto 70% compared to the three‐layer‐Cu(111)/SLG. A large available state near Fermi level (of Cu/Gr heterosystem) offers the conduction of more electrons from valence to conduction bands. With increasing copper/graphene thickness, this state is further broadened and provides an enhancement in conduction electrons. The electron localization function decreases with increasing thickness at the copper‐graphene junction, suggesting electrons are de‐localised at the junction, resulting in an increase of free electrons that enhance κ e and σ. This study is useful in advancing the thermal management of electronic chips and in applying hybrid copper‐graphene interconnects. This article is protected by copyright. All rights reserved.
materials science, multidisciplinary