Thermal conductivity of bulk electrodeposited metal-diamond composite materials for thermal management applications

H. Cho
2018-06-01
Abstract:This Ph.D research examined the feasibility of using the electrodeposition approach for the fabrication of metal-diamond heat sink materials, which can potentially be more economical compared to conventional high-temperature-high-pressure(HTHP) methods. This research also explored the heat exchange between metal and diamond, which have different major heat carriers. Initially, the thermal properties of electrodeposited metal-diamond composite materials as well as the implementation of structure-induced strengthening were of interest in this research. For this reason, the effect of the matrix grain size on the thermal and electrical conductivity of electrodeposited nickel was explored. The thermal conductivity of nickel monotonically decreased from 75W/mK to 67W/mK when the grain size changed from 47nm to 28nm. In the same grain size range, the electrical conductivity also decreased from 10.6×10S/m to 9.8×10S/m. The overall conductivity reductions are attributed to the additional scattering events at the grain boundaries. However, the grain boundary effect did not change the Lorenz numbers of the nanocrystalline nickel materials, which were ∼2.35×10−8WΩ/K2. This agrees with the Wiedemann-Franz law and implies that the electrons are the major heat carriers in nanocrystalline nickel. Secondly, 66 μm sized diamond particles were incorporated in the nickel matrix. Thermal conductivity enhancements were observed in polycrystalline(∼600nm) nickel from 89W/mK to 129W/mK at 35.4 vol.% diamond, and 77W/mK to 200W/mK at 59.8 vol.% diamond for nanocrystalline nickel(∼40nm), which provided the proof of concept in this research. Analysis of these data with the differential effective medium(DEM) model showed that the thermal boundary conductance of the polycrystalline nickel-diamond interface(7.5 MW/mK) was higher than the nanocrystalline nickel-diamond interface(6.6 MW/mK). This is likely related to the phonon transmission probability reduction due to extra grain boundary scattering. Lastly, the diamond particles were incorporated in electroplated copper matrix for achieving high thermal conductivity. Two different sized diamond particles were used: 66μm and 420μm. Surprisingly, only the 420μm sized diamond particles exhibited an increase in the thermal conductivity, reaching 454W/mK at 68.2 vol.%. With TiC coated 394μm sized diamond par-
Engineering,Materials Science
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