Regional lipid composition in the rat brain.

Mikuláš Chavko,Edwin M. Nemoto,J. Melick

DOI: https://doi.org/10.1007/BF03160026

Molecular and Chemical Neuropathology

Abstract:

What problem does this paper attempt to address?

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

Q. W. Zhou,L. Bolzoni,F. Yang

DOI: https://doi.org/10.1116/6.0003600

2024-05-20

Abstract:The interface structure holds paramount significance in enhancing the thermal conductivity (TC) of diamond/Cu composites, positioning them as a promising candidate for thermal management applications. Diamond/Cu composites (55% volume fraction) with three distinct interfacial carbides were fabricated via sintering at 950 °C using Cu and diamond powder coated with Ti, Cr, and W. During the sintering process, interfacial layers of TiC, Cr3C2, and W2C carbides formed at the composite interfaces. The findings reveal that the interfacial bonding strength among these three composites adheres to the following hierarchy: Ti-D/Cu exceeds Cr-D/Cu, which surpasses W-D/Cu. This hierarchy stems from the varying degrees of carbide coating integrity attained at 950 °C. Furthermore, the coating morphology differs on the diamond-{100} and -{111} crystal planes. Notably, among the interfacial carbides, TiC coating exhibits the most compact and contiguous structure postsintering. Consequently, Ti-D/Cu composites boast the highest density, reaching 95.49%, along with a remarkable TC of 317.66 W/mK. A comparative analysis of the fracture morphology of these composites reveals that Ti-D/Cu, characterized by the most robust interfacial bonding, exhibits a intransgranular fracture mechanism. This study offers profound insights and theoretical implications for the interface design of diamond/Cu composites, paving the way for their effective utilization in heat dissipation materials.
Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite

Yongjian Zhang,Guangzhu Bai,Xiangyu Zhu,Jingjie Dai,Xitao Wang,Jinguo Wang,Moon J. Kim,Hailong Zhang

DOI: https://doi.org/10.1016/j.mtcomm.2023.105357

IF: 3.8

2023-01-12

Materials Today Communications

Abstract:Interface engineering is fundamental to enhancing the thermal conductivity of Cu/diamond composite as promising thermal management material. To overcome the inherently non-affinity and large acoustic mismatch between Cu and diamond, a carbide interlayer is widely used to modify the Cu/diamond interface. Here, we employ a metal matrix alloying route to generate an in-situ carbide interlayer as thin as 22 nm in between Cu-B matrix and diamond particle filler, which is otherwise impossible for the ex-situ diamond surface coating route. However, a discrete carbide interlayer is inevitably obtained to create the thin interlayer because of the in-situ nucleation and growth of the interfacial carbide with the metal matrix alloying route. This study maintains an elaborate balance between the carbide thickness and the carbide coverage of the discrete carbide interlayer by manipulating the gas pressure infiltration parameters. As a result, the thermal conductivity of 913 W/mK is attained in the Cu-B/diamond composite with a small carbide thickness of 90%, which is the highest thermal conductivity so far reported in boron-modified Cu/diamond composites. This study provides guidance for interface engineering in Cu/diamond composite to enhance the thermal conductivity for thermal management applications.

materials science, multidisciplinary
Diamond coatings on copper surfaces through interface engineering

Zhipeng Wu,Aofei Mao,Luke Wadle,Xi Huang,Nada Kraiem,Jean-François Silvain,Bai Cui,Yongfeng Lu

DOI: https://doi.org/10.1016/j.diamond.2024.111549

IF: 3.806

2024-09-08

Diamond and Related Materials

Abstract:To address the challenges posed by the significant thermal stress and limited affinity of diamond coatings on copper (Cu) substrates, we developed a method combining femtosecond (fs) laser texturing with the application of a nickel (Ni) interlayer. This technique was utilized for adhesion enhancement of diamond coatings on Cu. By varying the deposition duration and microgrid depth through multiple fs laser scanning passes, it is possible to attain well-adhered diamond coatings on Cu substrates. These coatings demonstrate an outstanding quality factor of 93.4% and an average grain size of 5.5 μm. The enhanced adhesion results from the synergistic reinforcement of the mechanical interlock and anchoring mechanisms facilitated by the textured surface, further bolstered by the presence of the Ni interlayer. Moreover, the shape of the texture significantly influences the deposition outcome. Single-crystal diamonds with an average grain size of 10 μm were achieved on sharp microgrids at a substrate temperature of 550 °C. This work is expected to offer a general approach for deposition of diamond coatings on metallic materials with enhanced adhesion.

materials science, multidisciplinary,physics, applied, condensed matter, coatings & films
Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

Muhammad Dilawer Hayat,Harshpreet Singh,Kariappa Maletira Karumbaiah,Ying Xu,Xin-Gang Wang,Peng Cao

DOI: https://doi.org/10.1007/s11837-021-05054-6

2022-01-13

JOM

Abstract:The currently available heat-sink materials cannot meet the requirements for the 5G and beyond technology. Copper (Cu)/diamond composites have been proposed because Cu and diamond are excellent thermal conductors, while diamond has a very low coefficient of thermal expansion. Mixing Cu and diamond to form a composite seems a straightforward approach. However, this simple approach has never succeeded because, chemically, Cu does not wet diamond. Therefore the Cu-diamond interface cannot be tightly bonded, leading to an inferior thermal conductivity. This study presents a modified press and sinter process for depositing Cu submicronic particles onto diamond reinforcements prior to densification by hot pressing. The initial results obtained from microstructural observations and x-ray photoelectron spectroscopy have shown that our strategy can lead to successful Cu deposition onto diamond particles. The Cu deposition leads to a well-bonded interface between the copper matrix and diamond reinforcement, ultimately resulting in excellent thermal conductivity.

materials science, multidisciplinary,metallurgy & metallurgical engineering,mining & mineral processing,mineralogy
Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Bin Xu,Shih-Wei Hung,Shiqian Hu,Cheng Shao,Rulei Guo,Junho Choi,Takashi Kodama,Fu-Rong Chen,Junichiro Shiomi

DOI: https://doi.org/10.1016/j.carbon.2021.01.018

2021-01-05

Abstract:Aiming at developing high thermal conductivity copper/diamond composite, an unconventional approach applying self-assembled monolayer (SAM) prior to the high-temperature sintering of copper/diamond composite was utilized to enhance the thermal boundary conductance (TBC) between copper and diamond. The enhancement was first systematically confirmed on a model interface system by detailed SAM morphology characterization and TBC measurements. TBC significantly depends on the SAM coverage and ordering, and the formation of high-quality SAM promoted the TBC to 73 MW/m^2-K from 27 MW/m^2-K, the value without SAM. With the help of molecular dynamics simulations, the TBC enhancement was identified to be determined by the number of SAM bridges and the overlap of vibrational density of states. The diamond particles of 210 {\micro\metre} in size were simultaneously functionalized by SAM with the condition giving the highest TBC in the model system and sintered together with the copper to fabricate isotropic copper/diamond composite of 50% volume fraction. The measured thermal conductivity marked 711 W/m-K at room temperature, the highest value among the ones with similar diamond-particles volume fraction and size. This work demonstrates a novel strategy to enhance the thermal conductivity of composite materials by SAM functionalization.

Materials Science
Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface

Xiaoyan Liu,Fangyuan Sun,Wei Wang,Jie Zhao,Luhua Wang,Zhanxun Che,Guangzhu Bai,Xitao Wang,Jinguo Wang,Moon J. Kim,Hailong Zhang

DOI: https://doi.org/10.1007/s12613-021-2336-9

2022-10-07

Abstract:The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface. The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium (Cr) interlayer having a series of thicknesses from 150 nm down to 5 nm. The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance ( h ) between Cu and diamond. The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond. The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer. The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer. The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface, which plays a pivotal role in designing materials and devices for thermal management applications.
A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Guangzhu Bai,Jianwei Li,Yongjian Zhang,Changrui Wang,Xitao Wang,Hailong Zhang

DOI: https://doi.org/10.1016/j.vacuum.2024.113654

IF: 4

2024-09-16

Vacuum

Abstract:Cu/diamond composite is a promising thermal management material for heat dissipation of high-power electronic devices. Heat transfer models for a Cu-B/diamond composite with varying boron contents added in the Cu matrix were constructed using the finite element (FE) method, based on the results from transmission electron microscopy (TEM) characterization. The heat transfer behavior of the Cu/diamond composites was then investigated. The predicted effective thermal conductivities were compared to experimental values, using both analytical model calculation and FE simulation. The FE simulation effectively illustrates the dependence of thermal conductivity on interface structure evolution of the composite. The heat transfer behavior of the Cu-B/diamond composites varies as the boron content increases. In the Cu-0.3wt%B/diamond composite, most of the heat flow is concentrated and transferred along the diamond particles. In the Cu-1.0wt%B/diamond composite, the heat flux distribution and flow direction are similar to those in the Cu-0.3wt%B/diamond composite, but the heat flux is substantially lower. The heat transfer behavior is closely related to the interactions between the two phases in the composite and is intensively influenced by the evolution of interfacial carbide morphology. The FE simulation provides a more accurate prediction of effective thermal conductivity compared to the analytical model calculation, as it considers the reasonable interactions between the two phases relating to the actual interfacial structure. The findings provide a fundamental basis for optimizing the interfacial structure of Cu/diamond composites and further improving their thermal conductivity.

materials science, multidisciplinary,physics, applied
Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

Yizhe Cao,Bo Li,Lei Liu,Shaolong Li,Dongxu Hui,Shaodi Wang,Huiying Liu,Xin Li,Xin Zhang,Shengyin Zhou,Shufeng Li

DOI: https://doi.org/10.1016/j.jmrt.2024.10.250

IF: 6.267

2024-11-10

Journal of Materials Research and Technology

Abstract:The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal transport of heterogeneous interfaces is required, though the formation mechanism of such carbide interfaces during powder sintering remains under debate, particularly for the scenario of varying thermal diffusion. Here, systematic experiments of diamond/Cu–Cr composites have been conducted to unravel the effects of two important variables for thermal diffusion, temperature (800–1025 °C) and holding time (5–60 min), on the growth of chromium carbide interfaces and the resulting thermal conductivity. It is found that the main characteristics of chromium carbide layer is more related to the holding time, that is, prolonged thermal diffusion. The extraction of diamonds in as-sintered composites allows a detailed quantification of coating efficiency and crystallographic-facet-dependence of chromium carbide interfaces during diamond/metal reaction at varying temperature and holding times. It is found that the prolonged thermal diffusion is not as expected to deteriorate the thermal conductivity, and leads to a more densified structure with highest thermal conductivity instead (∼577 W/(m·K)). Furthermore, thermal diffusion of diamond/metal reaction is discussed based on theoretical models. We theoretically demonstrate that long thermal diffusion could enhance the thermal diffusivity for the composites and achieve ∼90.8% of theoretical thermal conductivity predicted by the Maxwell-Eucken model.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Effects of alloying elements on diamond/Cu interface properties based on first-principles calculations

Jinjiang Han,Z. Li,Ying Ren,Xuefeng Yang,Yue-Hao Li,Ying Li

DOI: https://doi.org/10.1088/1361-648X/acad54

2022-12-20

Abstract:Diamond/copper composites with high thermal conductivity and a variable thermal expansion coefficient are promising materials for thermal management applications. However, achieving the desired thermal conductivity of the composite material is difficult due to detachment or weak bonding between diamond and Cu. The interfacial properties of diamond/Cu composites can be improved using metal matrix alloying methods. In this study, we investigate the effects of alloying elements (B, Cr, Hf, Mo, Nb, Si, Ti, V, Zr) on the interfacial properties of diamond/Cu using first-principles calculations. Results showed that all alloying components could increase the interfacial bonding of diamond/Cu. Analysis of the electronic structure revealed that increased interfacial bonding strength after doping was the result of the stronger bonding of the alloying element atoms to the C atoms. The C atoms in the first layer of diamond at the interface formed wave peaks near the Fermi energy level after doping with B or Si atoms, facilitating electron–phonon interaction at the interface. The phonon properties of B4C and SiC were similar to those of diamond, which facilitated phonon–phonon coupling. B and Si were shown to be better alloying elements when interfacial bond strength and heat transfer were considered.

Medicine,Engineering,Physics,Materials Science
Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness

Jianquan Sang,Ye Yuan,Wulin Yang,Jiajun Zhu,Licai Fu,Deyi Li,Lingping Zhou

DOI: https://doi.org/10.1016/j.jallcom.2021.161777

IF: 6.2

2022-01-01

Journal of Alloys and Compounds

Abstract:To unravel the underlying causes of the opposite variation tendency in theoretical and experimental thermal conductivity of copper/diamond composites as the increasing thickness of nanoscale interface layer, WC layers with 70–400 nm thickness were prepared by magnetron sputtering W layers on the diamond substrates and following vacuum annealing treatment. The interface structure of the WC coated diamond was studied by TEM, and the density (ρ) of the WC layers was measured by the relative peaking intensity of the coating phase using the X-ray scattering strength method. Nanoindentation and four-point probe experiments were also carried out for indirectly characterizing average phonon velocity (ν) and thermal conductivity (KWC) of the WC layers. Interfacial thermal conductance (ITC) of the composites was calculated by the actual experimental ρ, ν and KWC of the WC nanoscale layers. Meanwhile, corresponding copper/diamond composites were fabricated by pressure-assisted infiltration method. The maximum thermal conductivity (TC) of the composite achieved 943 W·m−1·K−1. The variation trend of the actual TC in the composites was agreed with that of the calculated ones which were calculated by the ITC and differential effective medium (DEM) model. Based on the above quantitative analysis, the thermal boundary conductance of WC/Cu and diamond/WC interface is the main factor that leads to the variation of TC of the composites with the increase of the WC interlayer thickness. Optimizing a higher thermal boundary conductance by regulating the interlayer thickness is a crucial factor for enhancing the TC of the composite.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Exploring the Interface Structure on Interfacial Thermal Conductivity by Constructing Sandwich-like Cu/Diamond Slice/Cu Composite

Jiawei Zhao,Manxin Song,Kun Peng

DOI: https://doi.org/10.1007/s11837-023-05891-7

2023-05-17

JOM

Abstract:The structure and composition of interfacial carbide layer play a key role in the thermal conductivity of diamond/Cu composites; therefore, exploring the regulation method of carbide layer and its influence on interface thermal conductivity (ITC) was very important for the design and synthesis of diamond/Cu composites. In this article, diamond slice was applied, and sandwich-like copper/diamond slice/copper (Cu/DiaS/Cu) composites were designed to obtain more accurate results. Tungsten carbide layer on the diamond surface was fabricated by a thermal diffusion method. A simplified series model of thermal resistance was utilized to obtain the experimental ITC. With the increase of thermal diffusion temperature, thickness of the coating layer increased and WC was produced at 1100°C. The interfacial layer consisting of 501 nm W and 40 nm WC obtained by thermal diffusion at 1100°C for 150 min showed the best thermal properties, with an ITC of 10.16 MW m−2 K−1. After annealing at 1150°C for 150 min and 240 min, WC content increased while ITC decreased. The phase composition and thickness of tungsten coating layer significantly impacted the heat transfer between diamond and Cu matrix, a small amount of WC in the layer showed the highest ITC.

materials science, multidisciplinary,metallurgy & metallurgical engineering,mining & mineral processing,mineralogy
Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity

S.Q. Jia,L. Bolzoni,T. Li,F. Yang

DOI: https://doi.org/10.1016/j.jallcom.2023.169133

IF: 6.2

2023-02-05

Journal of Alloys and Compounds

Abstract:Due to the distinction of (111) and (100) faces on the diamond particle, the preferential formation of interface layers on the diamond particle is discovered when adding metal additives like titanium, chromium, aluminum in copper/diamond composites. The formed interface would affect the thermal conductivity of the copper/diamond composites. In this study, copper-55 vol%(Cr-coated) diamond composites were successfully produced by hot forging under 800 °C, 900 °C and 1050 °C. Heat treatment of Cr-coated diamond powders was conducted under a series of temperatures for studying the evolution of the carbide interface formation on surfaces of diamond particles. It was found that the average grain size of the Cr 7 C 3 on diamond (111) faces was larger than that on (100) faces when the temperature is below 850 °C, and the opposite trend was observed when the heat treatment temperature is above 850 °C. The Cr layer was fully transformed into Cr 7 C 3 when the temperature was above 950 °C. Unlike the results obtained after heat treatment, the interface layers was directly transformed into Cr 3 C 2 due to the non-equilibrium phase transformation after hot forging. The Cr 3 C 2 interface layers were preferentially kept on (100) diamond faces, and exfoliated on (111) faces after hot forging. The grain size of the formed Cr 3 C 2 on diamond (100) faces was increased with raising the hot forging temperature. The 1050 °C-hot-forged sample showed the highest thermal conductivity, attributed to large grain sizes of the Cr 3 C 2 interface layer. This study elaborates the mechanisms of the evolution of the interface layer formed under different temperatures on the diamond surfaces in copper-(Cr-coated) diamond composites, and the phenomenon of preferential formation of the interface layers is verified.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
The Microzone Structure Regulation of Diamond/Cu-B Composites for High Thermal Conductivity: Combining Experiments and First-Principles Calculations

Zhongnan Xie,Wei Xiao,Hong Guo,Boyu Xue,Hui Yang,Ximin Zhang,Shuhui Huang,Mingmei Sun,Haofeng Xie

DOI: https://doi.org/10.3390/ma16052021

IF: 3.4

2023-03-01

Materials

Abstract:The interface microzone characteristics determine the thermophysical properties of diamond/Cu composites, while the mechanisms of interface formation and heat transport still need to be revealed. Here, diamond/Cu-B composites with different boron content were prepared by vacuum pressure infiltration. Diamond/Cu-B composites up to 694 W/(mK) were obtained. The interfacial carbides formation process and the enhancement mechanisms of interfacial heat conduction in diamond/Cu-B composites were studied by HRTEM and first-principles calculations. It is demonstrated that boron can diffuse toward the interface region with an energy barrier of 0.87 eV, and these elements are energetically favorable to form the B4C phase. The calculation of the phonon spectrum proves that the B4C phonon spectrum is distributed in the range of the copper and diamond phonon spectrum. The overlapping of phonon spectra and the dentate structure together enhance the interface phononic transport efficiency, thereby improving the interface thermal conductance.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Clio Azina,Iñaki Cornu,Jean-François Silvain,Yongfeng Lu,Jean-Luc Battaglia

DOI: https://doi.org/10.1063/1.5052307

IF: 1.697

2019-05-01

AIP Advances

Abstract:Thermal properties of metal matrix composite materials are becoming ever more relevant with the increasing demand for thermally efficient materials. In this work, the thermal conductivity and heat transfers at the interfaces of copper matrix composite materials reinforced with diamond particles (Cu/D) are discussed. The composite materials contain either ZrC or TiC interphases and exhibit, respectively, higher and lower thermal conductivities with respect to their pure Cu/D counterparts. These thermal conductivities are accounted to the presence of strong covalent bonds and increased relative densities. The role of these interphases is also discussed regarding the phonon transmission at the interfaces.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Yanpeng Pan,Xinbo He,Shubin Ren,Mao Wu,Xuanhui Qu

DOI: https://doi.org/10.3390/ma12030475

IF: 3.4

2019-02-04

Materials

Abstract:In this study, diamond-copper composites were prepared with ZrC/Zr-coated diamond powders by spark plasma sintering. The magnetron sputtering technique was employed to coat the diamond particles with a zirconium layer. After heat treatment, most of the zirconium reacted with the surface of diamond and was transformed into zirconium carbide. The remaining zirconium on the zirconium carbide surface formed the outer layer. Owing to the method used to produce the ZrC/Zr-coated diamond in this study, the maximum thermal conductivity (TC) of 609 W·m−1·K−1 was obtained for 60 vol. % diamond-copper composites and the corresponding coefficient of thermal expansion (CTE) reached as low as 6.75 × 10−6 K−1. The bending strength of 40 vol. % ZrC/Zr-coated diamond-copper composites reached 255.95 MPa. The thermal and mechanical properties of ZrC/Zr-coated diamond-copper composites were substantially superior to those of uncoated diamond particles. Excellent properties can be attributed to the strengthening of the interfacial combination and the decrease in the interfacial thermal resistance due to the improvement associated with the ZrC/Zr coating. Theoretical analysis was also proposed to compare the thermal conductivities and CTE of diamond-copper composites fabricated with these two kinds of diamond powders.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles

Luhua Wang,Guangzhu Bai,Ning Li,Liyin Gao,Jianwei Li,Ke Xu,Xitao Wang,Hailong Zhang,Jinguo Wang,Moon J. Kim

DOI: https://doi.org/10.1016/j.vacuum.2022.111133

IF: 4

2022-08-01

Vacuum

Abstract:To overcome the drawback of weak interface bonding in diamond particles reinforced Cu matrix (Cu/diamond) composites, we prepared the Cu/Zr-diamond composites via a gas pressure infiltration method with Zr coatings with thicknesses from 47 nm to 430 nm on diamond surfaces. The scanning transmission electron microscopy (STEM) and X-ray diffraction (XRD) analyses reveal that during preparation the gradual transformation of metallic Zr to ZrC occurs through the diffusion of C atoms, and the crystallographic orientation relationship between diamond and ZrC is characterized as ( 1 ¯ 11)diamond//( 1 ¯ 11)ZrC and [110]diamond//[110]ZrC. The formed ZrC layer between diamond and Cu can bridge the large gap of acoustic impedance and greatly strengthen the interface bonding, and a maximal thermal conductivity of 735 W m−1 K−1 is achieved with the thickness of the interfacial ZrC layer of 50 nm (corresponding to Zr-coating thickness of 47 nm). However, with increasing the thickness of the interfacial ZrC layer, the composite thermal conductivity decreases attributed to the intrinsic low thermal conductivity of ZrC and the interface de-bonding with the large ZrC layer thickness. This study accurately establishes the relationship between interfacial structure and thermal conductivity and provides guidance for the interface design in Cu/diamond composites.

materials science, multidisciplinary,physics, applied
Copper–micrometer-sized diamond nanostructured composites

P. Carvalho,V. Livramento,N. Shohoji,J. B. Correia,H. Fernandes,C. Silva,D. Nunes

DOI: https://doi.org/10.1088/0031-8949/2011/T145/014069

2011-12-01

Abstract:Reinforcement of a copper matrix with diamond enables tailoring the properties demanded for thermal management applications at high temperature, such as the ones required for heat sink materials in low activated nuclear fusion reactors. For an optimum compromise between thermal conductivity and mechanical properties, a novel approach based on multiscale diamond dispersions is proposed: a Cu–nanodiamond composite produced by milling is used as a nanostructured matrix for further dispersion of micrometer-sized diamond (μDiamond). A series of Cu–nanodiamond mixtures have been milled to establish a suitable nanodiamond fraction. A refined matrix with homogeneously dispersed nanoparticles was obtained with 4 at.% μDiamond for posterior mixture with microdiamond and subsequent consolidation. Preliminary consolidation by hot extrusion of a mixture of pure copper and μDiamond has been carried out to define optimal processing parameters. The materials produced were characterized by x-ray diffraction, scanning and transmission electron microscopy and microhardness measurements.

Engineering,Physics,Materials Science
Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Yaqiang Li,Hongyu Zhou,Chunjing Wu,Zheng Yin,Chang Liu,Junyou Liu,Zhongliang Shi

DOI: https://doi.org/10.3390/nano13050878

2023-02-26

Abstract:Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W·m-1·K-1. The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm.
Microstructure evolution of diamond with molybdenum coating and thermal conductivity of diamond/copper composites fabricated by spark plasma sintering

DOI: https://doi.org/10.1007/s10854-022-08441-0

2022-06-12

Abstract:Molybdenum (Mo) coating was deposited on the diamond surface by vacuum micro-vapor deposition. Effects of deposition parameters on the formation of Mo coating on the diamond different crystal face was investigated. The mechanism of diamond metallization evolution, fracture mode and thermal conductivity of diamond/copper composites were discussed. It is shown that the coating of diamond particles is starting with point-like particles grew up to be continuous, dense spherical coating, and the compactness of the coating on diamond facet always takes precedence over diamond facet. The Mo coating on the diamond surface deposited at 1050 °C for 50 min shows the best quality. The fracture modes of Mo-coated diamond/copper composites are composed of diamond debonding from copper matrix, diamond transgranular fracture and copper ductile fracture, but some pores existed at the interfere, it concludes that the Mo 2 C prepare a Cu/Mo/diamondinterlayer between the diamond and copper matrix could improve the bonding between diamond and copper matrix, but the effect of Mo 2 C coating on strengthen the interfacial bonding is limited. The highest thermal conductivity of the composites achieved the value of 329 W/(m K).
Enhanced Interface Phonon Thermal Conductance via Boron Addition in Copper/Diamond Composites

Wei Xiao,Boyu Xue,Xue Wang,Zhongnan Xie,Lu Sun,Jianwei Wang,Hui Yang,Hong Guo,Ligen Wang

DOI: https://doi.org/10.2139/ssrn.3774508

2021-01-01

SSRN Electronic Journal

Abstract:Copper/diamond composites with various diamond contents are a prototype of thermal management materials and are widely used in many industrial fields due to their excellent thermo-physical properties. It is well known that the carriers of heat in diamond and copper are phonons and electrons, respectively. Scattering and phonon-electron interactions at the interface play a pivotal role on determining the interface thermal conductance. By using this model material the mechanisms of the interface thermal conductance are investigated by experiments and first-principles calculations. The boron addition can promote the thermal conductivity from 261 W/(mK) to 647 W/(mK) or increase the thermal conductivity by 2.5 times for the copper/diamond composite with 60% diamond. The increase of thermal conductivity may be explained by the formation of B4C and Cu-B solid solution at the interface. First-principles calculations show that the interface thermal resistance is mainly attributed to the phonon frequency mismatch and electronic transfer. The B4C phase formed at the interface assists the phonon conductance because the phonon spectrum of the B4C phase spreads across the range of Cu and diamond phonon spectra. The calculated results also show that boron can diffuse toward the interface region with an energy barrier of 0.87 eV and are energetically favorable to form the B4C phase. The present study provides valuable insight into the understanding of atomic mechanisms of thermal conductance at interfaces and a basis for exploring practical applications of the copper/diamond composites.

Regional lipid composition in the rat brain.

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite

Diamond coatings on copper surfaces through interface engineering

Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface

A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

Effects of alloying elements on diamond/Cu interface properties based on first-principles calculations

Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness

Exploring the Interface Structure on Interfacial Thermal Conductivity by Constructing Sandwich-like Cu/Diamond Slice/Cu Composite

Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity

The Microzone Structure Regulation of Diamond/Cu-B Composites for High Thermal Conductivity: Combining Experiments and First-Principles Calculations

Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles

Copper–micrometer-sized diamond nanostructured composites

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Microstructure evolution of diamond with molybdenum coating and thermal conductivity of diamond/copper composites fabricated by spark plasma sintering

Enhanced Interface Phonon Thermal Conductance via Boron Addition in Copper/Diamond Composites