Abstract:In recent years, the core-shell hybrid materials are one of the hotspots in current research and attracted widely attentions[I], The hybrid particles have good conductivity, while the density and cost would be greatly reduced as compared with the pure silver powder. And the hybrid particles have applied in the electromagnetic shielding materials, conductive coatings and absorbing materials because of its unique structure and physical and chemical properties. As a substitute for tin-lead solder, the conductive adhesive had some defects, such as high cost, high volume resistivity and thermal expansion coefficient(CTE)[2]. The silicon oxide had extremely low thermal expansion coefficient (CTE) and low price and the nano-silver particles had low temperature sinterability. So the SiO2@Ag hybrid materials applied in conductive adhesive may obviously reduce the thermal expansion coefficient (CTE) and cost, while maintaining a low volume resistivity. However, most of hybrid materials synthesis processes involved complicated procedure and equipment or expensive reagents and poor stability. [3, 4]So, herein, SiO2@Ag hybrid particles with uniform, dense coverage and thickness controllable silver layers were successfully prepared by a simple and environmentally friendly approach without surface modification of SiO2. The effects of activation process, reaction solution concentration and size and type of silicon oxide on the growth of silver nanoparticles were studied emphatically. At the same time, the hybrid particles were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), Energy Dispersive X-ray microanalysis (EDS) and UV-Vis absorption spectroscopy. The results show that the crystallinity of silver layer was good and the morphology of silver nanoparticles on the surface of SiO2 could be tailored with changing in the type of silicon. If sintering the hybrid particles at 200 degrees C for 30min and the silver nanoparticles on the surface of SiO2 became larger obviously. Comparing with the traditional conductive adhesive which usually has the CTE 1/CTE2 at 120ppm and 220ppm, here using the SiO2@Ag hybrid particles as filler, the CTE 1/CTE2 could be greatly reduced to 25ppm and 45ppm meanwhile still keep the good conductivity of 5.0x 10(-5) Omega.cm.

Facet-controlled synthesis of silver microsheets for printed flexible conductive film based on SO42- and Ce4+ ions: An experimental and DFT study

Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Scalable synthesis of the mono-dispersed silver micro-dendrites and their applications in the ultralow cost printed electrically conductive adhesives

Room‐Temperature Metallic Fusion‐Induced Layer‐by‐Layer Assembly for Highly Flexible Electrode Applications

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Acid Treatment of Silver Flake Coatings and Its Application in the Flexible Electrical Circuits

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

Transparent Conductive Films Based on Silver Nanowires and SiO2 Nanoparticles for Flexible Electronics

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Hybrid silver pastes with synergistic effect of multi-scale silver fillers and the application in flexible circuits

Synthesis And Characterization Of Silica-Silver Core-Shell Structural Spheres And Its Application In Conductive Adhesive

Controlled synthesis, optical and electric performances of flexible transparent silver nanowire conductive films

Improved Performance by SiO2 Hollow Nanospheres for Silver Nanowire-Based Flexible Transparent Conductive Films.

Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering.

Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Novel Method of Ordering Silver Nanowires for Synthesizing Flexible Films and Their Conductivity

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives