Progressive carrier density optimization contributes to enhanced thermoelectric performance in Bi(Te, Se) compound

Xinxiu Cheng,Liqing Xu,Wei Liu,Xiangdong Ding,Wenke He,Yu Xiao
DOI: https://doi.org/10.1016/j.jallcom.2023.172817
IF: 6.2
2023-11-17
Journal of Alloys and Compounds
Abstract:Layered BiTe and BiSe compounds present promising n -type thermoelectric performance, but the intrinsic high carrier density limits ZT value near room temperature. In this work, thermoelectric performance in Bi(Te, Se) compound is significantly improved by progressively optimizing its carrier density. The room-temperature carrier density is reduced from ∼5.5 × 10 20 cm −3 in Bi 0.99 Te to ∼2.21 × 10 20 cm −3 in Bi 0.92 Sn 0.07 Te 0.4 Se 0.6 -2%Cu, which can lead to obvious enhancement of Seebeck coefficient and power factor, and thus the room-temperature power factor increases from ∼4.17 μW cm −1 K −2 in Bi 0.99 Te to ∼9.78 μW cm −1 K −2 in Bi 0.92 Sn 0.07 Te 0.4 Se 0.6 -2%Cu. Moreover, the largely suppressed total thermal conductivity in Bi 0.92 Sn 0.07 Te 0.4 Se 0.6 -2%Cu also benefit from lowered carrier density because of reduced electronic thermal conductivity, as well as intensified phonon scattering caused by imported point defects. Finally, a room-temperature ZT of ∼0.29 and a peak value of ∼0.41 at 373 K in Bi 0.92 Sn 0.07 Te 0.4 Se 0.6 -2%Cu are achieved successfully, which are ∼6 and ∼3 times higher than that in Bi 0.99 Te, respectively.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
What problem does this paper attempt to address?