Optimizing thermoelectric properties of BiSe through Cu additive enhanced effective mass and phonon scattering

Xing-Chen Shen,Xiao Zhang,Bin Zhang,Guo-Yu Wang,Jian He,Xiao-Yuan Zhou

DOI: https://doi.org/10.1007/s12598-020-01491-5

IF: 6.318

2020-07-17

Rare Metals

Abstract:<span class="a-plus-plus abstract-section id-a-sec1"><p class="a-plus-plus">Known as a weak topological insulator (TI), BiSe structurally exhibits alternating stacks of quantum spin Hall bilayer ("Bi<sub class="a-plus-plus">2</sub>") and three-dimensional TI layer ("Bi<sub class="a-plus-plus">2</sub>Se<sub class="a-plus-plus">3</sub>"). The low lattice thermal conductivity of BiSe due to the presence of Bi<sub class="a-plus-plus">2</sub> bilayers promises potentially good thermoelectric performance. Herein, the thermoelectric properties of nominal Bi<sub class="a-plus-plus">1−<em class="a-plus-plus">x</em></sub>Cu<sub class="a-plus-plus"><em class="a-plus-plus">x</em></sub>Se samples were studied as the functions of the content of Cu additive and temperature. It is found that Cu additives in BiSe (1) profoundly affect the texture of densified polycrystalline samples by inclining the crystallographic <em class="a-plus-plus">c</em>-axis parallel toward the pressure direction in the densification process, (2) increase considerably the effective mass and thus the Seebeck coefficient, and (3) yield point defects and Cu–Se secondary phases that effectively scatter heat-carrying phonons. As a result, the optimized electrical and thermal properties yield a thermoelectric figure of merit of <em class="a-plus-plus">zT </em>~ 0.29 in Bi<sub class="a-plus-plus">1−<em class="a-plus-plus">x</em></sub>Cu<sub class="a-plus-plus"><em class="a-plus-plus">x</em></sub>Se (<em class="a-plus-plus">x</em> = 0.03) sample at 467 K in parallel to the pressure direction and a <em class="a-plus-plus">zT</em> ~ 0.20 at 468 K in the perpendicular direction.</p></span><span class="a-plus-plus abstract-section id-a-sec2 outputmedium-online"><h3 class="a-plus-plus">Graphic abstract</h3></span>

materials science, multidisciplinary,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

This paper aims to solve the problem of how to optimize the thermoelectric properties of bismuth selenide (BiSe) by adding copper (Cu). Specifically, the effects of Cu additives with different contents on the microstructure, electrical and thermal properties of BiSe thermoelectric materials were studied. The main objectives of the paper include:

1. **Improve the effective mass and Seebeck coefficient**: The Cu additive significantly increases the effective mass of BiSe, thereby increasing the Seebeck coefficient, which is one of the key factors for improving thermoelectric performance.
2. **Enhance phonon scattering**: The Cu additive forms point defects and Cu - Se nano - precipitates in BiSe. These defects and precipitates effectively scatter phonons that carry heat, reducing the lattice thermal conductivity.
3. **Optimize electrical and thermal properties**: Through the above mechanisms, the Cu additive optimizes the electrical and thermal properties of BiSe, thereby increasing the thermoelectric figure of merit (zT).

Through experimental and theoretical analysis, the paper shows how the Cu additive improves the thermoelectric performance of BiSe in multiple aspects, and finally achieves the highest thermoelectric figure of merit zT* = 0.29 under specific conditions (such as at a temperature of 467 K). This indicates that the Cu additive is an effective strategy that can significantly enhance the thermoelectric performance of BiSe.