Room-Temperature, Solution-Processed SiO x via Photochemistry Approach for Highly Flexible Resistive Switching Memory

Pengfei Li,Dan Wang,Zongbo Zhang,Yunlong Guo,Lang Jiang,Caihong Xu

DOI: https://doi.org/10.1021/acsami.0c16556

2020-11-24

Abstract:Due to its high versatility and cost-effectiveness, solution process has a remarkable advantage over physical or chemical vapor deposition (PVD/CVD) methods in developing flexible resistive random-access memory (RRAM) devices. However, the reported solution-processed binary oxides, the most promising active layer materials for their compatibility with silicon-based semiconductor technology, commonly require high-temperature annealing (&gt;145 °C) and the RRAMs based on them encounter insufficient flexibility. In this work, an amorphous and uniform SiO<i>_x</i> active layer was prepared by irradiating an inorganic polymer, perhydropolysilazane, with a vacuum ultraviolet of 172 nm at room temperature. The corresponding RRAM showed typical bipolar resistance switching with a forming-free behavior. The device on polyimide film exhibited outstanding flexibility with a minimum bending radius of 0.5 mm, and no performance degradation was observed after bending 2000 times with a radius of 2.3 mm, which is the best among the reported solution-processed binary oxide-based RRAMs and can even rival the performance of PVD/CVD-based devices. This room-temperature solution process and the afforded highly flexible RRAMs have vast prospects for application in smart wearable electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c16556?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c16556</a>.XRD patterns of the Au substrate and VUV-irradiation SiO<i>_x</i> films on Au substrate (Figure S1); the SEM image of the SiO<i>_x</i> layer on Au/glass substrate (Figure S2); the electroforming-free performance of the prepared device (Figure S3); <i>I</i>–<i>V</i> curves in a semilogarithmic plot of the Ag/SiO<i>_x</i>/Au/glass device in vacuum environment (7.4 × 10^–3 Pa) (Figure S4); the wide-scan XPS spectra of the SiO<i>_x</i> fabricated with different heating temperatures and VUV-irradiation processes (Figure S5); the <i>I</i>–<i>V</i> curve for the 8 nm device after a few cycles and the 50 nm device (Figure S6); the relationship between the coefficient of variation (σ/μ) and size (Figure S7); the <i>I</i>–<i>V</i> curve of the HRS fitting with SCLC, P-F emission, and thermionic emission mechanism; the <i>I</i>–<i>V</i> curves of the HRS fitting with the Schottky emission mechanism at different temperatures from 303 to 343 K (Figure S8); the <i>I</i>–<i>V</i> measurement result during 349 cycles corresponding to <a class="internalNav" href="#fig3">Figure </a><a class="internalNav" href="#fig3">3</a>c drawn in a diagram (Figure S9); the <i>I</i>–<i>V</i> measurement result for Ti/SiO<i>_x</i>/Au/glass during 108 cycles (Figure S10); the resistance of HRS and LRS as a function of the bending strain in outward direction (Figure S11); the change of the resistance with bending numbers in outward direction with a radius of 0.5 mm (Figure S12); the nano-indentation test (by Agilent Nano Indenter G200) for the SiO<i>_x</i> layer (Figure S13); the device-to-device data corresponding to <a class="internalNav" href="#fig6">Figure </a><a class="internalNav" href="#fig6">6</a>a,c,d, respectively (Figure S14); the pictures of the hand-made hinge structure (Figure S15); and the details of the bending experiments (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c16556/suppl_file/am0c16556_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

materials science, multidisciplinary,nanoscience & nanotechnology