Abstract:The theoretical equation of thermosonic bond strength involving interfacial deformation and microcontact phenomena is presented in this study. The constitutive equation of gold considering the ultrasonic softening mechanism was developed based on the thermosonic bonding experiments and coded into the FE software. The numerical model of bonding was established to estimate the surface exposure and the effective normal pressure. The real contact area was calculated by a microcontact model. Accordingly, the nominal bond strength can be obtained and verified by the experimental data. It is found that a better conjunction exists at the edge of the contact area because large surface exposure is produced there, which is also proved by the SEM image of a sheared ball bond. Increasing the bonding force or the ultrasonic power will increase the interfacial plastic deformation, the nominal and real contact areas, but decreases the effective normal pressure. The contact ratio increases to a maximum with the increase in the bonding force, and then decreases while it continues to decrease with the increase in the ultrasonic power. In addition, both the stress analysis and experimental result show that cratering and damage to the pad structure are easily produced below the edge region of the contact area under an excessive bonding force or ultrasonic power.

Numerical Study on theEffects ofBondParameters on Thermosonic BondStrength

Numerical Study on the Effects of Bond Parameters on Thermosonic Bond Strength

Numerical and Experimental Analysis of Thermosonic Bond Strength Considering Interfacial Contact Phenomena

Parameter Sensitivity Analysis For Thermosonic Bonding Process By Finite Element Method

Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Mechanism Analysis of Process Parameters Effects on Bondability in Ultrasonic Ball Bonding

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Experiment study of temperature parameter effect on bonding process and quality in thermosonic wire bonding

Modeling and Multi-Parameter Simulation in Thermosonic Bonding Process

Effect of Ultrasonic Parameters on Bonding Quality of Rolled T2 Copper Foil and Au Wire

A Study of the Copper Wire Ball Bonding Processes

Bonding Strength at Micro and Nano Levels

Experimental study on bond behavior of single particle

Effect of Contact Velocity on the Bondability of Stitch Bonding

Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding

Numerical Simulation on Microdofect Evaluation of Diffusion Bonded Joints by Resistance Approach

Temperature effect in thermosonic wire bonding

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

Finite Element Analysis Of Influence Of Passivation Layer On Cu/Low-K Structure During Thermosonic Cu Wire Bonding

STUDY ON VIBRATION CHARACTERISTICS OF CAPILLARY IN AN ULTRASONIC WIRE BONDING SYSTEM