Photoelasticity-based Stress Field Analysis of Glass under 1064 Nm Laser Irradiation

Nan Zhao,Hongchao Zhang,Jian Lu,Mao Tang,Hailong Zhang
DOI: https://doi.org/10.1016/j.optlaseng.2024.108367
IF: 5.666
2024-01-01
Optics and Lasers in Engineering
Abstract:Laser-induced thermal cracking in glass cutting surpasses traditional methods. Understanding dynamic thermal stresses is crucial for exploring mechanisms and controlling trajectories. We developed a real-time stress measurement system using the photoelastic method. Scanning soda-lime glass with a 1064 nm laser at various speeds, we analyzed stress changes with a finite element model. Results revealed phase entanglement issues, resolved by phase unwrappling. Stress differences peaked at 105 MPa (2 mm/s) and 78 MPa (4 mm/s). 2 mm/s scanning led to wider, longerwrapp cracks than 4 mm/s due to higher stress levels. Simulation and experimental results agreed, enhancing stress analysis comprehensively.
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