Abstract:We review recent advances in experimental methods for high spatial-resolution and high time-resolution thermometry, and the application of these and related methods for measurements of thermal transport in low-dimensional structures. Scanning thermal microscopy (SThM) achieves lateral resolutions of 50 nm and a measurement bandwidth of 100 kHz; SThM has been used to characterize differences in energy dissipation in single-wall and multi-wall carbon nanotubes. Picosecond thermoreflectance enables ultrahigh time-resolution in thermal diffusion experiments and characterization of heat flow across interfaces between materials; the thermal conductance G of interfaces between dissimilar materials spans a relatively small range, 20 <G <200 MW m(-2) K-1 near room temperature. Scanning thermoreflectance microscopy provides nanosecond time resolution and submicron lateral resolution needed for studies of heat transfer in microelectronic, opto-electronic and micromechanical systems. A fully-micromachined solid immersion lens has been demonstrated and achieves thermal-radiation imaging with lateral resolution at far below the diffraction limit, <2 mum. Microfabricated metal bridges using electrical resistance thermometry and joule heating give precise data for thermal conductivity of single crystal films, multilayer thin films, epitaxial superlattices, polycrystalline films, and interlayer dielectrics. The room temperature thermal conductivity of single crystal films of Si is strongly reduced for layer thickness below 100 nm. The through-thickness thermal conductivity of Si-Ge and GaAs-AlAs superlattices has recently been shown to be smaller than the conductivity of the corresponding alloy. The 3omega method has been recently extended to measurements of anisotropic conduction in polyimide and superlattices. Data for carbon nanotubes measured using micromachined and suspended heaters and thermometers indicate a conductivity near room temperature greater than diamond.

Multi-pulse Thermoreflectance Imaging with Structure Function Analyses for Measuring Thermophysical Properties of Microscale Heterostructures

Pulsed Thermoreflectance Imaging for Thermophysical Properties Measurement of GaN Epitaxial Heterostructures.

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Thermal Conductivity Imaging at Micrometre-Scale Resolution for Combinatorial Studies of Materials

Invited Article: Micron Resolution Spatially Resolved Measurement of Heat Capacity Using Dual-Frequency Time-Domain Thermoreflectance.

Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method.

High-Throughput Thermophysical Characterization of Semiconductors

Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface

Precise nanoscale temperature mapping in operational microelectronic devices by use of a phase change material

The Ultrafast Laser Pump-Probe Technique for Thermal Characterization of Materials With Micro/Nanostructures

Three-Sensor 3Ω-2Ω Method for the Simultaneous Measurement of Thermal Conductivity and Thermal Boundary Resistance in Film-on-Substrate Heterostructures

Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Frequency-resolved Raman Thermometry Analysis via a Multi-layer Heat Transfer Model for Bulk and Low-dimensional Materials

Simultaneous Measurement of Thermal Conductivity and Specific Heat in a Single TDTR Experiment

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Thermal characterization of thin films: A chip-based approach for in-plane property analysis

Simultaneous Measurement of Thermal Conductivity and Heat Capacity Across Diverse Materials Using the Square-Pulsed Source (SPS) Technique

Ultrafast Thermoreflectance Techniques for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films