Abstract:We review recent advances in experimental methods for high spatial-resolution and high time-resolution thermometry, and the application of these and related methods for measurements of thermal transport in low-dimensional structures. Scanning thermal microscopy (SThM) achieves lateral resolutions of 50 nm and a measurement bandwidth of 100 kHz; SThM has been used to characterize differences in energy dissipation in single-wall and multi-wall carbon nanotubes. Picosecond thermoreflectance enables ultrahigh time-resolution in thermal diffusion experiments and characterization of heat flow across interfaces between materials; the thermal conductance G of interfaces between dissimilar materials spans a relatively small range, 20 <G <200 MW m(-2) K-1 near room temperature. Scanning thermoreflectance microscopy provides nanosecond time resolution and submicron lateral resolution needed for studies of heat transfer in microelectronic, opto-electronic and micromechanical systems. A fully-micromachined solid immersion lens has been demonstrated and achieves thermal-radiation imaging with lateral resolution at far below the diffraction limit, <2 mum. Microfabricated metal bridges using electrical resistance thermometry and joule heating give precise data for thermal conductivity of single crystal films, multilayer thin films, epitaxial superlattices, polycrystalline films, and interlayer dielectrics. The room temperature thermal conductivity of single crystal films of Si is strongly reduced for layer thickness below 100 nm. The through-thickness thermal conductivity of Si-Ge and GaAs-AlAs superlattices has recently been shown to be smaller than the conductivity of the corresponding alloy. The 3omega method has been recently extended to measurements of anisotropic conduction in polyimide and superlattices. Data for carbon nanotubes measured using micromachined and suspended heaters and thermometers indicate a conductivity near room temperature greater than diamond.

High-Throughput Thermophysical Characterization of Semiconductors

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Decoupling of Thermo-Electronic Effect by Traveling Photothermal Mirror Method for Characterization of Thermal Properties of Semiconductors

Fast, Spatially Resolved Thermometry of Si and GaP Crystals Using Pump-Probe Two-Photon Absorption

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

The Ultrafast Laser Pump-Probe Technique for Thermal Characterization of Materials With Micro/Nanostructures

Time-resolved laser scanning photothermal microscopy for characterization of thermal properties of semi-insulating GaAs

Simultaneous Measurement of Thermal Conductivity, Heat Capacity, and Interfacial Thermal Conductance by Leveraging Negative Delay-Time Data in Time-Domain Thermoreflectance

Probing carrier and phonon transport in semiconductors all at once through frequency-domain photoreflectance

Probing carrier and phonon transport in semiconductors all at once through frequency-domain photo-reflectance

Application on Laser-induced Photothermal Technique to Semiconductor Property Measurement

Deep learning-based data processing method for transient thermoreflectance measurements

Accurate and wide-range measurement of thermal conductivity of semiconductor materials by laser-excited Raman spectroscopy

Multi-pulse Thermoreflectance Imaging with Structure Function Analyses for Measuring Thermophysical Properties of Microscale Heterostructures

Thermal characterization of thin films: A chip-based approach for in-plane property analysis

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Wafer-Level Simultaneous Film Thickness and Thermal Conductivity Characterizations for Bonded Si-on-Si

Nondestructive Evaluation of Semiconductors by Photoacoustic Imaging with High-Frequency Air Transducer

A New Noncontact Probe for Thermophysical Properties of Solid Surfaces

Transducer-Less Thermoreflectance Technique for Measuring Thermal Properties of the Buried Buffer Layer and Interface in GaN-based HEMTs