Low Operation Voltage, High-Temperature Reliable, and High-Yield BEOL Integrated Hf$_{\text{0}.\text{5}}$Zr$_{\text{0}.\text{5}}$O$_{\text{2}}$ Ferroelectric Memory Arrays

Shuming Guo,Jiajie Yu,Hao Wang,Xingcheng Jin,Hongbo Li,Chao Wu,Lin Chen,Yinyin Lin,David Wei Zhang
DOI: https://doi.org/10.1109/ted.2024.3394460
IF: 3.1
2024-01-01
IEEE Transactions on Electron Devices
Abstract:Emerging embedded nonvolatile memory (eNVM) based on hafnium oxide ferroelectric materials has shown great advantages such as high reliability, high speed, good scalability, and CMOS process compatibility. Here, a 2T2C structure ferroelectric memory (FRAM) is proposed based on the 180-nm CMOS technology and a TiN/Hf $_{\text{0}.\text{5}}$ Zr $_{\text{0}.\text{5}}$ O $_{\text{2}}$ /TiN ferroelectric capacitor. The device exhibits great ferroelectric properties with the remnant polarization (2P $_{\text{r}}\text{)}$ of 30 $\mu$ C/cm $^{\text{2}}$ under a low operation voltage of 2 V. Also, it shows great high-temperature endurance and retention properties, which has no obvious degradation after 10 $^{\text{10}}$ cycles pulses and 10 $^{\text{4}}$ s under 175 $^{\circ}$ C. In addition, a 2-Mb capacity memory chip with 16 $\times$ 128 kb subarrays using the 2T2C structure and separated word lines (WLs) was fabricated. The wafer can maintain a high yield of 98.28% after baking for 30 h at 175 $^{\circ}$ C, which shows great reliability in the chip level.
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