Reducing Cf/SiC Composite Damages Through Collaborative Control of Laser Ablating Depth and Grinding Modes

Guijian Xiao,Xin Li,Kun Zhou,Yi He,Zhengyu Yang
DOI: https://doi.org/10.1016/j.compstruct.2024.118158
IF: 6.3
2024-01-01
Composite Structures
Abstract:Cf/SiC composites are regarded as difficult-to-machine aerospace materials. A low-damage surface machining of Cf/SiC composite by laser-ablating assisted grinding (LAAG) was conducted, and investigated the effects of laserablating depth and grinding modes on surface/subsurface damages. The results showed that ablated material depth reached 420 mu m after 1200 times scanning, while the effective ablating rate was inhibited by the depth. Compared with down grinding, the grinding forces and temperatures were substantially higher in up grinding, with a maximum increase of 123.5 % and 140 % in normal and tangential grinding forces, respectively; however, micro brittle fracture and ductile removal were remarkably enhanced in normal and transverse fibers, and surface macroscopic damage has been suppressed; subsurface damage remained insignificant, mainly exhibited in internal micro cracks and minor interfacial debonding. It was attributed to cutting characteristics of up grinding. Furthermore, as grinding depth increased, the material removal behavior underwent a brittle-ductile transition and the surface roughness grew accordingly. Moreover, a laser scanning angle of 0 degrees and up grinding facilitated the occurrence of longitudinal fiber debonding, producing larger sized fiber bundle chips. Combining up grinding with 90 degrees scanning angle at low grinding depth was an effective method to improve the surface quality of Cf/SiC composite.
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