Investigation on the machined surface quality and removal mechanism of SiCf/SiC composites in ultrasonic-assisted grinding

Zikang Zhang,Songmei Yuan,Qilin Li,Xiaoxing Gao,Xinlu Ouyang,Yang Luo
DOI: https://doi.org/10.1007/s00170-022-10469-9
IF: 3.563
2022-11-19
The International Journal of Advanced Manufacturing Technology
Abstract:Abstract SiCf/SiC composites have been applied in numerous fields owing to their excellent out-of-plane properties, impact resistance, and delamination resistance. However, such composites are hard and brittle, and thus result in the formation of defects. In this study, we analyse the removal mechanism of different regions of the SiCf/SiC composites. Additionally, we investigate the effects of machining variables (spindle speed, feed rate and cutting depth) on the grinding force and surface roughness of SiCf/SiC composites in conventional grinding (CG) and ultrasonic-assisted grinding (UAG). The composites exhibit damage in the forms of matrix breakage, matrix cracks, fibre fracture, fibre debonding and interfacial debonding. The fibre removal modes in CG and UAG are different. Brittle fracture is the predominant material removal mechanism in CG and UAG. Results show that the grinding force and surface roughness decrease as the spindle speed increases, whereas they increase with the feed rate and cutting depth. Compared with CG, UAG is a more efficient and precise material processing method for reducing the grinding force and improving the machined surface quality. The findings of this study offer meaningful guidelines for improving the grinding process and machining efficiency of SiCf/SiC composites.
engineering, manufacturing,automation & control systems
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