Grindability and surface quality of SiCp/Al composites with resin bond and electroplated wheels
Guoqiang Yin,Yujie Hao,Jinyuan Wang,Yunhe Zhou,Yunguang Zhou
DOI: https://doi.org/10.1007/s00170-024-14386-x
IF: 3.563
2024-09-11
The International Journal of Advanced Manufacturing Technology
Abstract:In this paper, a theoretical model for the grinding force of SiCp/Al composites was established. The model introduces a novel approach by integrating the SiC particle fracture force, the arc length of contact between the grinding wheel and workpiece, and the maximum undeformed chip thickness, all grounded in the principles of chip formation and friction forces. The accuracy of the grinding force theoretical model was validated through grinding experiments. Additionally, the effects of machining parameters and grinding wheel types on grinding force, surface roughness, and surface morphology were further investigated. The results indicate that as the grinding depth and feed speed increase, both the grinding force and surface roughness increase, resulting in poorer material surface quality. Conversely, when the grinding wheel speed increases, both the grinding force and surface roughness decrease, leading to better material surface quality. Compared to using electroplated diamond wheels, the use of resin bond wheel results in lower grinding force, lower surface roughness, and improved surface morphology, which proves that resin bond wheel has better grinding performance when grinding SiCp/Al composites with SiC volume fraction of 20%. This study indicates that the research facilitates the calculation of grinding forces in actual machining processes, as well as the selection of grinding parameters and types of grinding wheels.
engineering, manufacturing,automation & control systems