Tantalum Nitride Thin Film with a Nearly Zero Temperature Coefficient of Resistance Synthesized by Magnetron Co-Sputtering

Yifei Chen,Jiahui Zhang,Hongyang Gou,Xintong Wang,Yigang Chen,Haibo Guo
DOI: https://doi.org/10.1016/j.vacuum.2024.113092
IF: 4
2024-01-01
Vacuum
Abstract:In deposition of nitride films through reactive sputtering, the degree of nitrogen dissociation from N2 in vacuum chambers is small and difficult to control, while the nitrogen sputtered from a nitride target is in the ionic state, reactive, and tunable through the power of the target. In this study, co-sputtering of TaN target and Ta target is used to prepare tantalum nitride films of Ta2N phase with low resistance and low temperature coefficient of resistance (TCR). We investigated effects of the power of the TaN target and annealing temperature on the phase, structure, and electrical properties of the thin films, and obtained an optimal Ta2N-phase thin-film with adjustable resistance in the low segment and a TCR of -8 ppm/degrees C.
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